5962-9461204HUX datasheet, PDF

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5962-9461204HUX: DescriptionFlash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66; Categorystorage storage; File Size160KB，15 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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5962-9461204HUX Overview

Flash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66

5962-9461204HUX Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	1.075 INCH, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	70 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	27.3 mm
memory density	16777216 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.34 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	27.3 mm
Base Number Matches	1

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WF512K32-XXX5

HI-RELIABILITY PRODUCT

512Kx32 5V FLASH MODULE, SMD 5962-94612

FEATURES

Access Times of 60, 70, 90, 120, 150ns

Packaging

• 66 pin, PGA Type, 1.075" square, Hermetic

Ceramic HIP (Package 400

(1)

)

• 68 lead, 40mm, Low Capacitance Hermetic CQFP

(Package 501)

• 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP

(Package 502)

• 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm

(0.140") high, (Package 510)

• 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5mm

(0.140") high, (Package 519)

100,000 Erase/Program Cycles Minimum

Sector Architecture

• 8 equal size sectors of 64KBytes each

• Any combination of sectors can be concurrently erased.

Also supports full chip erase

Organized as 512Kx32

Commercial, Industrial and Military Temperature Ranges

5 Volt Programming. 5V

10% Supply.

Low Power CMOS, 6.5mA Standby

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

Built-in Decoupling Caps for Low Noise Operation

Page Program Operation and Internal Program Control Time

Weight

WF512K32-XG2UX5 - 8 grams typical

WF512K32-XH1X5 - 13 grams typical

WF512K32-XG4X5 - 20 grams typical

WF512K32-XG4TX5 - 20 grams typical

WF512K32-XG1UX5 - 5 grams typical

1. Call factory for PGA type (HIP) package options.

Note: See Flash Programming Application Note 4M5 for algorithms.

FIG. 1

I/O

PIN CONFIGURATION FOR WF512K32N-XH1X5

TOP VIEW

GND

I/O

GND

I/O

PIN DESCRIPTION

I/O

0-31

0-18

1-4

GND

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

BLOCK DIAGRAM

W E

512K x 8

W E

512K x 8

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

April 2001 Rev. 4

White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520

5962-9461204HUX Related Products

	5962-9461204HUX	5962-9461201HUX	5962-9461202HUX	5962-9461203HUX
Description	Flash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66	Flash Module, 512KX32, 150ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66	Flash Module, 512KX32, 120ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66	Flash Module, 512KX32, 90ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66
package instruction	1.075 INCH, CERAMIC, HIP-66	1.075 INCH, CERAMIC, HIP-66	1.075 INCH, CERAMIC, HIP-66	1.075 INCH, CERAMIC, HIP-66
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	70 ns	150 ns	120 ns	90 ns
Other features	USER CONFIGURABLE AS 2M X 8	USER CONFIGURABLE AS 2M X 8	USER CONFIGURABLE AS 2M X 8	USER CONFIGURABLE AS 2M X 8
Spare memory width	16	16	16	16
JESD-30 code	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66
length	27.3 mm	27.3 mm	27.3 mm	27.3 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE
memory width	32	32	32	32
Number of functions	1	1	1	1
Number of terminals	66	66	66	66
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	512KX32	512KX32	512KX32	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	4.34 mm	4.34 mm	4.34 mm	4.34 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	27.3 mm	27.3 mm	27.3 mm	27.3 mm
Base Number Matches	1	1	1	1
Maker	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation

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