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5962-9458506H6X

Description
EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, HIP-66
Categorystorage    storage   
File Size297KB,15 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

5962-9458506H6X Overview

EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, HIP-66

5962-9458506H6X Parametric

Parameter NameAttribute value
package instructionCERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time120 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density4194304 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal locationPERPENDICULAR
Maximum write cycle time (tWC)10 ms
Base Number Matches1
WE128K32-XXX
HI-RELIABILITY PRODUCT
128Kx32 EEPROM MODULE, SMD 5962-94585
FEATURES
s
Access Times of 120, 140, 150, 200, 250, 300ns
s
Packaging:
• 66-pin, PGA Type, 27.3mm (1.075") square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 40mm CQFP (G4), (Package 501)
• 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180") high,
(Package 509)
• 68 lead, 22.4mm sq. Low Profile CQFP (G1U), 3.57mm
(0.140") high, (Package 519)
Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
Write Endurance 10,000 Cycles
Data Retention Ten Years Minimum (at +25°C)
Commercial, Industrial and Military Temperature Ranges
Low Power CMOS
s
s
s
s
s
s
s
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s
Weight
WE128K32-XG2TX - 8 grams typical
WE128K32-XG1UX - 5 grams typical
WE128K32-XH1X - 13 grams typical
WE128K32-XG4X - 20 grams typical
s
s
s
s
s
FIG. 1
PIN CONFIGURATION FOR WE128K32N-XH1X
TOP VIEW
PIN DESCRIPTION
34
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
56
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
23
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
I/O
28
A
0
A
1
A
2
I/O
23
OE
WE
1
CS
1
A
0-16
128K x 8
V
CC
GND
NC
BLOCK DIAGRAM
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
I/O
22
I/O
21
I/O
20
128K x 8
128K x 8
128K x 8
8
8
8
8
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Nov 2000 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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