EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-02-1961-C

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AG-02-1961-C Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-02-1961-C - - View Buy Now

WBC-B0202AG-02-1961-C Overview

Resistor Networks & Arrays

WBC-B0202AG-02-1961-C Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics plc
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
Not sure about GPRS?
Recently, the company is going to start a project: the data of the on-site gas meter is sent to the company's server via GPRS. I don't know what this is all about. Please explain it to me. Thank you i...
hjyhjony Embedded System
Holtek launches A/D type microcontroller
Following the HT46R23 and HT46R24, Holtek Semiconductor has launched the HT46R232. This version combines the features and advantages of the HT46R24, which provides more I/O pins and PWM output, with t...
rain MCU
Application skills/Data access and software upgrade based on P89C51RD2 IAP function
Abstract : Analyze some source codes in Boot ROM, focusing on IAP function and the relationship between ISP and IAP; use IAP function to convert the remaining program space into data space, and write ...
rain 51mcu
Life is short, just live beautifully
[i=s]This post was last edited by chenzhufly on 2014-12-30 11:15[/i] [p=26, null, center][color=rgb(73, 73, 73)][backcolor=rgb(246, 246, 246)][font=Arial, Helvetica, sans-serif, 宋体][size=14px][img]htt...
chenzhufly Talking
How to use the 5V output of a microcontroller to drive a 24V solenoid valve?
A microcontroller is an integrated circuit chip that uses ultra-large-scale integrated circuit technology to integrate a central processing unit (CPU) with data processing capabilities, random access ...
灞波儿奔 Microcontroller MCU
About include path
#include "\software\ucos-ii\source\ucos_ii.h"As mentioned above, my .h complete path is "D:\Program Files\uc\SOFTWARE\uCOS-II\SOURCE"Why is it that only the following path is sufficient?Isn't this an ...
wangxingfei Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1355  1390  2021  2416  1160  28  41  49  24  38 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号