Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
This high performance leader provides a more cost
effective solution where very low on-resistance is
required, but enhanced peak load voltage is not
required.
PAA150
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-Pin Packages
•
Machine Insertable, Wave Solderable
•
Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
PAA150
PAA150P
PAA150PTR
PAA150S
PAA150STR
Description
8-Lead DIP (50/tube)
8-Lead Flatpack (50/tube)
8-Lead Flatpack (1000/Reel)
8-Lead Surface Mount (50/tube)
8-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control - Switch #1
- Control - Switch #1
+ Control - Switch #2
- Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PAA150
Ratings
250
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous *
Peak
On-Resistance, AC/DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
10ms
I
L
=250mA
V
L
=250V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
-
-
-
110
-
0.7
1.2
-
3
250
±500
7
1
2.5
0.5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
µA
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=250mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
µA
pF
*NOTE: If both poles operate simultaneously, then load current must be derated in order not to exceed the package power dissipation value.
2
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Manufacturing Information
Moisture Sensitivity
PAA150
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PAA150 / PAA150S / PAA150P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PAA150 / PAA150S
PAA150P
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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Mechanical Dimensions
PAA150
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
PAA150
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
PAA150S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
1.65
(0.0649)
8.90
(0.3503)
0.457 ± 0.076
(0.018 ± 0.003)
4.445 ± 0.127
(0.175 ± 0.005)
0.65
(0.0255)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
PAA150P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
2.159 ± 0.025
(0.085 ± 0.001)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
PCB Land Pattern
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
1.55
(0.0610)
8.70
(0.3425)
0.203 ± 0.013
(0.008 ± 0.0005)
0.65
(0.0255)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
Dimensions
mm
(inches)
4
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PAA150
PAA150STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K
0
=4.90
(0.193)
K
1
=4.20
(0.165)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
Embossed Carrier
Embossment
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
PAA150PTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Embossed Carrier
K
0
= 2.70
(0.106)
K
1
= 2.00
(0.079)
P = 12.00
(0.472)
User Direction of Feed
Ao = 10.30
(0.406)
Dimensions
mm
(inches)
Embossment
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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