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5962-9561307HYX

Description
Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32
Categorystorage    storage   
File Size115KB,10 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

5962-9561307HYX Overview

Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

5962-9561307HYX Parametric

Parameter NameAttribute value
package instruction0.600 INCH, CERAMIC, DIP-32
Reach Compliance Codeunknown
Maximum access time35 ns
Other featuresBATTERY BACKUP
JESD-30 codeR-CDIP-T32
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Base Number Matches1
WMS512K8-XXX
HI-RELIABILITY PRODUCT
512Kx8 MONOLITHIC SRAM, SMD 5962-95613
FEATURES
s
Access Times 15, 17, 20, 25, 35, 45, 55ns
s
MIL-STD-883 Compliant Devices Available
s
Revolutionary, Center Power/Ground Pinout
JEDEC Approved
• 36 lead Ceramic SOJ (Package 100)
• 36 lead Ceramic Flat Pack (Package 226)
s
Evolutionary, Corner Power/Ground Pinout
JEDEC Approved
• 32 pin Ceramic DIP (Package 300)
• 32 lead Ceramic SOJ (Package 101)
• 32 lead Ceramic Flat Pack (Package 220)
• 32 lead Ceramic Flat Pack (Package 142)
s
32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)
s
Commercial, Industrial and Military Temperature Range
s
5 Volt Power Supply
s
Low Power CMOS
s
Low Power Data Retention for Battery Back-up Operation
s
TTL Compatible Inputs and Outputs
REVOLUTIONARY PINOUT
36 FLAT PACK
36 CSOJ
EVOLUTIONARY PINOUT
32 DIP
32 CSOJ (DE)
32 FLAT PACK (FE)*
32 FLAT PACK (FD)
32 CLCC
TOP VIEW
A0
A1
A2
A3
A4
CS
I/O0
I/O1
V
CC
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
TOP VIEW
A12
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
V
CC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
TOP VIEW
A14
A16
A18
A15
V
CC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O1
I/O2
V
SS
I/O3
I/O4
I/O5
I/O6
A17
V
CC
WE
A13
A8
A9
A11
OE
A10
CS
I/O7
PIN DESCRIPTION
A
0-18
I/O
0-7
CS
OE
WE
V
CC
GND
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
*Package not recommended for new designs, "FD" recommended for new designs.
October 2000 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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