576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM
| K4R761869A-FbCcN1 | K4R761869A-GCT9 | K4R761869A-GCN1 | K4R761869A-GCM8 | K4R761869A-FCT9 | K4R761869A-FCM8 | K4R761869A-F | |
|---|---|---|---|---|---|---|---|
| Description | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM |
| Is it Rohs certified? | - | conform to | conform to | conform to | incompatible | incompatible | - |
| package instruction | - | FBGA, BGA92,10X18,32 | FBGA, BGA92,10X18,32 | FBGA, BGA92,10X18,32 | TFBGA, BGA92,10X18,32 | TFBGA, BGA92,10X18,32 | - |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | - |
| Maximum access time | - | 32 ns | 32 ns | 40 ns | 32 ns | 40 ns | - |
| I/O type | - | COMMON | COMMON | COMMON | COMMON | COMMON | - |
| JESD-30 code | - | R-PBGA-B92 | R-PBGA-B92 | R-PBGA-B92 | R-PBGA-B92 | R-PBGA-B92 | - |
| JESD-609 code | - | e1 | e1 | e1 | e0 | e0 | - |
| memory density | - | 603979776 bi | 603979776 bi | 603979776 bi | 603979776 bi | 603979776 bi | - |
| Memory IC Type | - | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | - |
| memory width | - | 18 | 18 | 18 | 18 | 18 | - |
| Number of terminals | - | 92 | 92 | 92 | 92 | 92 | - |
| word count | - | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | - |
| character code | - | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | - |
| organize | - | 32MX18 | 32MX18 | 32MX18 | 32MX18 | 32MX18 | - |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | FBGA | FBGA | FBGA | TFBGA | TFBGA | - |
| Encapsulate equivalent code | - | BGA92,10X18,32 | BGA92,10X18,32 | BGA92,10X18,32 | BGA92,10X18,32 | BGA92,10X18,32 | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | - | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | - |
| Peak Reflow Temperature (Celsius) | - | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | - | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| surface mount | - | YES | YES | YES | YES | YES | - |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Terminal surface | - | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | - | BALL | BALL | BALL | BALL | BALL | - |
| Terminal pitch | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - |
| Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| Maximum time at peak reflow temperature | - | 40 | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED | - |
京公网安备 11010802033920号
EEWORLD
