5962-9561307HXA datasheet, PDF

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5962-9561307HXA: DescriptionStandard SRAM, 512KX8, 35ns, CMOS, CDFP36, CERAMIC, DFP-36; Categorystorage storage; File Size226KB，43 Pages; ManufacturerWhite Microelectronics

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5962-9561307HXA Overview

Standard SRAM, 512KX8, 35ns, CMOS, CDFP36, CERAMIC, DFP-36

5962-9561307HXA Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, DFP-36
Reach Compliance Code	unknown
Maximum access time	35 ns
JESD-30 code	R-CDFP-F36
JESD-609 code	e0
length	23.365 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	36
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.18 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	12.955 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Added device types 05 through 10. Added case outlines X, Z, and T.

Redrew entire document.

Added device types 11 through 13. Added case outline U.

Made changes in accordance with NOR 5962-R289-97. -sld

Table I; Changed the max limit for the operating supply current test

for device types 05-10 from 130 mA to 135 mA. Table I; Changed

the max limit for data retention current (I

CCDR1

) for device types 05-10

from 3.0 mA to 7.0 mA. Add vendor cage 88379 for device types 11,

12, and 13 per letter dated 1 MAY 1997. -sld

Add device type 14.

Changes to case outlines U and X.

Add: note to paragraph 1.2.2 and table I, conditions. Add device types

15 through 27, case outlines M, N, and 9, vendor CAGE code

0EU86, condition D to paragraphs 4.2.a.1 and 4.3.3.b.1. Changes to

table I and dimensions to case outlines T, U, Y, and Z. Table I, add

note 3 to C

and C

OUT

Table I; Changed the I

from 8 mA to 6 mA for device types 07-14

and 21-27 for the V

test. Added device types 28, 29, and 30.

Editorial changes throughout. -sld

DATE (YR-MO-DA)

96-08-23

96-10-22

97-04-28

98-02-18

APPROVED

K. A. Cottongim

98-06-22

99-04-30

01-02-08

K. A. Cottongim

Raymond Monnin

04-05-28

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil/

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, MEMORY, DIGITAL, SRAM,

512K x 8-BIT, MONOLITHIC SILICON

DRAWING APPROVAL DATE

95-11-07

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-95613

DSCC FORM 2233

APR 97

5962-E263-04

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

3.2.5 Block diagram. The block diagram shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit used to test product shall be equivalent to the circuit specified on figure 7.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests

for each subgroup are described in table I.

3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked

with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for

each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if

any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made

available to the preparing activity (DSCC-VA) upon request.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing.

The certificate of compliance submitted to DSCC-VA shall affirm that the manufacturer's product meets the requirements of

MIL-PRF-38534 and the requirements herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in

the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function

as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:

Burn-in test, method 1015 of MIL-STD-883.

(1)

Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control

and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015

of MIL-STD-883.

as specified in accordance with table 1 of method 1015 of MIL-STD-883.

(2)

Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests

prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-5000

SIZE

REVISION LEVEL

5962-95613

SHEET

DSCC FORM 2234

APR 97

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