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5962-9471605H8C

Description
Flash Module, 128KX32, 60ns, 1.075 INCH, HIP-66
Categorystorage    storage   
File Size277KB,41 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

5962-9471605H8C Overview

Flash Module, 128KX32, 60ns, 1.075 INCH, HIP-66

5962-9471605H8C Parametric

Parameter NameAttribute value
package instruction1.075 INCH, HIP-66
Reach Compliance Codeunknown
Maximum access time60 ns
JESD-30 codeS-XHIP-P66
JESD-609 codee4
length27.305 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialUNSPECIFIED
encapsulated codeHIP
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.34 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationHEX
width27.305 mm
Base Number Matches1
REVISIONS
LTR
A
B
DESCRIPTION
Added device type 05. Added case outlines M, N, 4, 5, 6, 7, and 8.
Added vendor cage code 88379.
Figure 1; For case outlines 5, 6, 7 and 8 changed dimension D3 min
and max from 1.030 and 1.040 inches to 1.020 and 1.060 inches.
Changed dimension A min from .156 inches to .135 inches. Changed
dimension L min from .145 inches to .132 inches. -sld
Added case outline 9. Figure 1; changed case outline M to be either
a single or dual cavity package. Figure 1; changed the dimension A2
max limit from .015 inches to .025 inches for case outline M. Added
thermal resistance ratings for all case outlines to paragraph 1.3 .
Added vendor cage 88379 for case outline M, device types 01
through 05. Table I; changed I
OL
from 12.0 mA to 8.0 mA for the V
OL
test. -sld
Added vendor cage code 0EU86 for device types 01 through 05, case
outline N. Drawing updated to reflect current requirements. -sld
Added case outline A. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
DATE (YR-MO-DA)
96-08-30
98-06-25
APPROVED
K. A. Cottongim
K.A. Cottongim
C
00-06-20
Raymond Monnin
D
E
F
03-01-13
03-02-21
03-11-10
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
35
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
F
19
F
20
F
21
F
1
F
22
F
2
F
23
F
3
F
24
F
4
F
25
F
5
F
26
F
6
F
27
F
7
F
28
F
8
F
29
F
9
F
30
F
10
F
31
F
11
F
32
F
12
F
33
F
13
F
34
F
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Kendall A. Cottongim
DRAWING APPROVAL DATE
94-12-16
MICROCIRCUIT, HYBRID, DIGITAL, FLASH
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 128K x 32-BIT
SIZE
A
SHEET
CAGE CODE
REVISION LEVEL
F
67268
1 OF
35
5962-94716
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
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