Spec No. JELF243A-9106F-01
Reference Only
P.1/8
CHIP COIL（CHIP INDUCTORS）LQH32CH□□□□53L
Murata Standard Reference Specification【AEC-Q200】
1.Scope
This Reference specification applies to LQH32CH_53L series, Chip coil (Chip Inductors) for automotive Electronics
based on AEC-Q200.
2.Part Numbering
(ex)
LQ
H
32
C
H
1R0
M
5
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
Operating
Temperature Range.
Storage
Temperature Range.
Customer
Part Number
MURATA
Part Number
LQH32CH1R0M53L
LQH32CH2R2M53L
LQH32CH3R3M53L
LQH32CH4R7M53L
LQH32CH6R8M53L
LQH32CH100K53L
LQH32CH150K53L
LQH32CH220K53L
– 40 °C to + 85 °C
– 40 °C to +
105 °C
Inductance
(µH)
1.0
2.2
3.3
4.7
6.8
10
15
22
±10%
±20%
DC
Resistance
(Ω)
Tolerance
0.060±30%
0.097±30%
0.12±30%
0.15±30%
0.25±30%
0.30±30%
0.58±30%
0.71±30%
Self
Resonant
Frequency
(MHz min)
100
64
50
43
32
26
26
19
Rated
Current
(mA)
1000
790
710
650
540
450
300
250
5A
ESD
Rank
5A: 8kV
∗When
applied Rated current to the products , self temperature rise shall be limited to 20℃ max and Inductance
will be within ±10% of initial Inductance value.
4. Testing Conditions
《Unless
otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
: Ordinary Humidity / 25%(RH) to 85%(RH)
Humidity
《In
case of doubt》
Temperature : 20°C± 2°C
Humidity
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
2.5 ± 0.2
1.55 ± 0.15
2.5 ± 0.2
A
A
2.5 ± 0.2
3.2 ± 0.3
A : 2.8 max.
■
Unit Mass (Typical value)
0.045g
※
No marking.
0.9 ± 0.31.3 ± 0.2 0.9 ± 0.3
MURATA MFG.CO., LTD
Spec No. JELF243A-9106F-01
Reference Only
Specification
Inductance shall meet item 3.
P.2/8
6. Electrical Performance
No.
6.1
Item
Inductance
Test Method
Measuring Equipment :
KEYSIGHT 4192A
or equivalent
Measuring Frequency : 1MHz
Measuring Equipment : Digital multi meter
Measuring Equipment :
KEYSIGHT E4991A
or equivalent
6.2
6.3
DC
Resistance
Self Resonant
Frequency
(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
7. AEC-Q200 Requirement
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
Meet Table A after testing.
1000hours at 85 deg C
3 High
Table A
Set for 24hours at room
Temperature
Appearance
No damage
temperature, then measured.
Exposure
Inductance change
Within ±5%
DC Resistance
Within ±5%
Change
4
Temperature
Cycling
1000cycles
-40 deg C to + 85deg C
Set for 24hours at room
temperature,then
measured.
1000hours at 85 deg C,
85%RH
unpowered.
Meet Table A after testing.
7
Biased Humidity
Meet Table A after testing.
8 Operational Life
Apply 85 deg C 1000 hours Meet Table A after testing.
Set for 24hours at room
temperature, then measured
Visual inspection
Meet ITEM 5
（Style
and Dimensions）
Per
MIL-STD-202
Method 215
No abnormalities
No defects
9 External Visual
10 Physical
Dimension
12 Resistance
to Solvents
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Condition C:
100g’s/6ms/Half sine
14 Vibration
Meet Table A after testing.
5g's for 20 minutes,
No defects
12cycles eah of 3 orientations
Test from 10-2000Hz.
Murata deviation request :
Pre-heating: 150C+/-5C, 60s+/-5s
Meet Table A after testing.
15 Resistance
No-heating
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
MURATA MFG.CO., LTD
Spec No. JELF243A-9106F-01
Reference Only
Murata Specification / Deviation
ESD Rank: Refer to Item 3. Rating.
No defects
Method b : Not Applicable
90% of the terminations is to be soldered.
(Except exposed wire)
No defects
Not Applicable
Murata deviation request: 30s
No defects
No defects
P.3/8
No
Stress
17 ESD
18 Solderbility
AEC-Q200
Test Method
Per AEC-Q200-002
Per J-STD-002
19 Electrical
Characterization
20 Flammability
21 Board Flex
Measured : Inductance
Per UL-94
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
22 Terminal Strength Per AEC-Q200-006
A force of 17.7N for 60s
8. Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
φ
1.5
-0
+0.1
※
Lead- in/out wire
1.75±0.1
(0.2)
0.2
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
3.5±0.05
3.6±0.2
4.0±0.1
2.9±0.2
4.0±0.1
1.7±0.2
2.0±0.05
Direction of feed
Dimension of the Cavity is measured at the bottom side.
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
8.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm / min
0.2N to 0.7N
(minimum value is typical)
165 to 180 degree
F
Cover tape
8.0±0.2
Plastic tape
MURATA MFG.CO., LTD
Spec No. JELF243A-9106F-01
Reference Only
Trailer
Leader
Label
190 min.
Empty tape
φ
13.0±0.2
P.4/8
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
2.0±0.5
160 min.
210 min.
Cover tape
φ
60±
0
1
9±
1
0
13±1.4
φ
180±
3
0
φ
21.0±0.8
Direction of feed
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc
½½½
∗1)
<Expression of Inspection No.>
(1)
Factory Code
□□
OOOO
×××
(1)
(2)
(3)
(2) Date
(3)
Serial No.
First digit
Second digit
Third, Fourth digit
: Year / Last digit of year
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
: Day
∗2)
« Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc
½½½
8.8. Specification of Outer Case
Outer Case Dimensions
(mm)
W
D
H
186
D
W
Label
H
Standard Reel Quantity in Outer Case
(Reel)
5
186
93
∗Above
Outer Case size is typical. It depends on a quantity of an order
9.
Caution
9.1Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(7) Traffic signal equipment
(1) Aircraft equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(9) Data-processing equipment
(4) Power plant control equipment
(10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
MURATA MFG.CO., LTD
Spec No. JELF243A-9106F-01
Reference Only
P.5/8
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering
5.5
Reflow Soldering
∗
Chip Coil
5.5
Land
Solder Resist
2.0
1.0
1.0
1.3
1.0
1.3
1.0
(in mm)
∗
Applicable to flow soldering.
10.2 Flux, Solder
Flux
Solder
・Use
rosin-based flux.
・Don’t
use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・
Don’t use water-soluble flux.
・Use
Sn-3.0Ag-0.5Cu solder
・Standard
thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
10.3 Flow soldering / Reflow soldering conditions
Pre-heating
should be in such a way that the temperature difference between solder and product surface is
limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Standard
soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
½Soldering
profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(s)
Standard Profile
Pre-heating
Heating
Cycle of flow
2 times
250
℃
, 4s
½6s
Limit Profile
265
℃
±3
℃
, 5s
1 time
150
℃
, 60s min.
MURATA MFG.CO., LTD
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