etal Glaze
Power Pack
Resistors
rface Mount High
Power
Metal Glaze™ Power Pack Surface Mount High
ensity Ceramic
Package
Power Density Ceramic Package
™
Series
Make Possible
Not
Series
Glaze
™
Power Pack
Recommended for New Designs
Metal
PPS-1
nductance
Low inductance
0.1Ω to 348KΩ range
to 348KΩ
range
rior
surge
handling capability
Superior surge handling capability
C maximum
150°C maximum operating temperature
operating
PPS-1 Series
temperature
t performance
inductance
•
Low
- standard 2010
footprint
1 Watt performance - standard 2010 footprint
•
0.1Ω
to 348KΩ
range
eproof ceramic package provides superior temperature
rise
profile
Flameproof ceramic package provides superior
150°C maximum operating temperature
•
temperature rise profile
•
1
Watt performance - standard 2010
footprint
•
Flameproof ceramic package provides superior temperature
rise
profile
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
Surface Mount High
Power
Density Ceramic
Package
•
Superior surge handling capability
ctrical Data
Type
Size
ze
Electrical
Maximum
Data
Power Rating
Maximum
Type
PPS-1
1W
Working
Voltage¹
Working
Voltage¹
Maximum
Voltage
Maximum
Voltage
Resistance Range
(ohms)
Tolerance
Resistance Range
(ohms)
(±%)²
Tolerance
(±%)²
TCR
(ppm/°C)²
TC
(ppm
Power Rating
1W
10
PPS-1
2010
350
350
700
700
0.1
0.1 to 0.99
to 0.99
348K
1, 2, 5
1, 2, 5
1,
100
5
2,
50, 100
1, 2, 5
10
50,
1.0 to
1.0 to
348K
¹Not to exceed (
√
P x R ).
²Consult
factory for
tighter tolerances and TCRs.
ceed (
√
P x R ).
²Consult
factory for
tighter tolerances and TCRs.
Applications
The PPS-1 will dissipate
1 watt
at 70°C on a 2010
footprint.
The PPS-1 is recommended
for
applications where
cations
board real estate
or
component/board TCE mismatch is a major concern. It is also recommended in circuits
PS-1 will
where a standard
watt
at 70°C on a 2010
or
unacceptable performance
is recommended
for
applications
dissipate
1
2010 resistor exhibits marginal
footprint.
The PPS-1
due to high power density/surge
handling demands.
real estate
or
component/board TCE mismatch is a major concern. It is also recommended in
a standard 2010 resistor exhibits marginal
or
unacceptable performance due to high power density
Environmental Data
ng demands.
Characteristic
Thermal Shock
Maximum Change
±(0.5% + 0.01 ohm)
±(0.25% + 0.01 ohm)
Test Method
MIL-R-55342E
Par
4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E
Par
4.7.4 (-65°C @
working voltage)
MIL-R-55342E
Par
4.7.5 (2.5 x (PxR)
½
ironmental Data
Short Time Overload
Low Temperature Operation
cteristic
High Temperature Exposure
Maximum Change
±(1.0% + 0.01 ohm)
±(0.5% + 0.01 ohm)
MIL-R-55342E
Par
4.7.6 (+150°C
for
100 hours)
Test Method
cycles)
voltage)
mal Shock
Resistance to Bonding Exposure
±(0.25% + 0.01 ohm)
±(0.5% + 0.01 ohm)
95%
+ 0.01 ohm)
±(0.25%
minimum coverage
MIL-R-55342E
Par
4.7.7 (Reflow soldered to board @ 260°C
MIL-R-55342E
Par
4.7.3 (-65°C + 150°C, 5
for
10 seconds)
MIL-STD-202, Method
Par
(245°C
for
5 seconds)
working
MIL-R-55342E
208
4.7.4 (-65°C @
MIL-R-55342E
Par
4.7.8 (10 cycles, total 240 hours)
Solderability
emperature Operation
Moisture Resistance
Life Test
Time Overload
±(1.0% + 0.01 ohm)
±(0.5% + 0.01 ohm)
±(1% + 0.01 ohm)
±(0.5% + 0.01 ohm)
±(1.0% + 0.01 ohm)
MIL-R-55342E
Par
4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip
for
60
MIL-R-55342E
Par
4.7.6 (+150°C
for
100
seconds
MIL-R-55342E
Par
4.7.5 (2.5 x (PxR)
½
Temperature Exposure
Strength
Terminal Adhesion
hours)
Resistance to Board Bending
±(0.25% + 0.01 ohm)
±(1% + 0.01 ohm)
tance to Bonding Exposure
General Note
Chip mounted in center of 90mm long board, deflected 5mm
to
MIL-R-55342E
Par
4.7.7 (Reflow soldered
so as to exert pull on chip contacts
for
10 seconds
board @
for
10 seconds)
MIL-STD-202, Method 208 (245°C
for
5 seconds)
A subsidiary of
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specification without notice or liability.
TT electronics plc
TT Electronics reserves the right to make changes in
South Staples Street • Corpus
Christi
notice or liability.
product specification without
Texas
78411 USA
Wire and Film Technologies Division
•
ure Resistance
992
is
7900 •
Facsimile:
361 992 3377 •
own
4222
±(0.5% + 0.01
at time of going to print.
MIL-R-55342E
Par
4.7.8
PPS-1 Series Issue December
total 240 hours)
(10 cycles,
2008 Sheet 1 of 2
All information subject to TT Electronics’
Website: www.irctt.com
data and is considered accurate
ohm)
Telephone:
361
IRC reserves the right to make changes in product specification without notice or liability.
General Note
to IRC’s own data and is considered accurate at time of going to print.
All information is subject
General Note
rability
95% minimum coverage
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
www.ttelectronicsresistors.com
http://www.ttelectronics.com/resistors
est
© TT Electronics plc
© TT Electronics plc
±(1.0% + 0.01 ohm)
MIL-R-55342E
Par
4.7.10 (2000 hours @ 70°C interm
07.14
07.14
Metal Glaze™ Power Pack Surface Mount
™
Metal Glaze™ Power Pack Surface Mount
High Power Density Ceramic Package
High Power Density Ceramic Package
Metal Glaze Power Pack
PPS-1 Series
Surface Mount High Power
Designs
PPS-1 Series
Not Recommended for New
Density Ceramic Package
Make Possible
Physical Data (Inches and (mm))
Top View:
0.170 ± 0.010
(4.32 ± 0.25)
0.130 ± 0.005
(3.30 ± 0.13)
0.079 ± 0.006
(2.01 ± 0.15)
0.200 ± 0.010
(5.08 ± 0.25)
Side View:
0.105 ± 0.005
(2.67 ± 0.13)
0.130 ± 0.005
(3.30 ± 0.13)
Ordering Data
Sample Part No.
IRC Type
(PPS1)
PPS1 100
1000
F
Temperature Coefficient
Resistance Value
Tolerance
F = 1%, G = 2%, J = 5%
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPS-1 Series Issue December 2008 Sheet 2 of 2
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
General Note
© TT Electronics plc
© TT Electronics plc
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
www.ttelectronicsresistors.com
All information is subject
the
TT Electronics’
changes in
and is considered accurate at time of
or liability.
TT Electronics reserves
to
right to make
own data
product specification without notice
going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
07.14
07.14
Metal Glaze™ Power Pack Surface Mount
Metal Glaze™ Power Pack Surface Mount
High Power Density Ceramic Package
High Power Density Ceramic Package
PPS-1 Series
PPS-1 Series
Make Possible
Not Recommended for New Designs
Ordering Procedure
This product has two valid part numbers:
European (Welwyn) Part Number: PPS1-100RFI
(PPS1 with TCR ±100ppm/°C at 100 ohms ±1%, Pb-free)
P
P
1
1
Type
PPS1
2
TCR (ppm/°C)
Omit for ±100
-50 = ±50
S
1
2
3
Value
E24 = 3/4 characters
E96 = 4/5 characters
R = ohms
K = kilohms
-
1
0
3
4
F = ±1%
G = ±2%
J = ±5%
0
R
F
4
I
5
5
I = Pb-free, Tape Pack
PB = SnPb, Tape Pack
500/reel
Tolerance Termination & Packing
USA (IRC) Part Number: PPS11001000FLF
(PPS1 with TCR ±100ppm/°C at 100 ohms ±1%, Pb-free)
P
P
1
1
Type
PPS1
2
TCR
S
1
1
0
2
3
Value
0
1
0
3
4
Tolerance
F = ±1%
G = ±2%
J = ±5%
0
0
F
4
L
5
5
Termination & Packing
Omit for SnPb
LF = Pb-free
500/reel
F
50 = ±50 3 digits + multiplier
100 = ±100
R = ohms for
values <100 ohms
General Note
General Note
TT
TT Electronics reserves the right to make changes
product specification without notice or
or liability.
Electronics reserves the right to make changes in
in product specification without notice
liability.
All
All information
subject to
to TT Electronics’ own data and
considered accurate at
at time of going to print.
information is
is subject
TT Electronics’ own data and is
is considered accurate
time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
www.ttelectronicsresistors.com
©© TT Electronics plc
TT Electronics plc
07.14
07.14
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