CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features (TB379).
2. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
[align=left]FIFO is the abbreviation of First Input First Output, a first-in-first-out queue. It is a traditional sequential execution method and a first-in-first-out data buffer. The difference betwe...
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introduction
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t...[Details]
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FPGA/CPLD
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