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JANTXV1N5518UR

Description
Zener Diode, 3.3V V(Z), 20%, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MLL34, MELF-2
CategoryDiscrete semiconductor    diode   
File Size185KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

JANTXV1N5518UR Overview

Zener Diode, 3.3V V(Z), 20%, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MLL34, MELF-2

JANTXV1N5518UR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid2125383043
Parts packaging codeDO-213AA
package instructionR-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
Other featuresMETALLURGICALLY BONDED
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-213AA
JESD-30 codeR-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeRECTANGULAR
Package formLONG FORM
polarityUNIDIRECTIONAL
Certification statusNot Qualified
Nominal reference voltage3.3 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum voltage tolerance20%
Working test current20 mA
1N5518B thru 1N5546B-1
Low Voltage Avalanche
500 mW Zener Diodes DO-35
Qualified per MIL-PRF-19500/437
DESCRIPTION
The 1N5518 thru 1N5546 series of 0.5 watt axial-leaded glass Zener Voltage Regulators
provides a selection from 3.3 to 33 volts with tolerances ranging from plus/minus 1% to 20%.
The standard tolerance is plus/minus 5% with the B suffix unless ordered otherwise. These
axial-leaded glass DO-35 Zeners are also available with an internal metallurgical bond option.
This type of bonded Zener package construction is also available in JAN, JANTX, and
JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet
higher and lower power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
Available on
commercial
versions
Qualified Levels:
JAN, JANTX and
JANTXV
FEATURES
JEDEC registered 1N5518 thru 1N5546.
Voltage tolerances of plus/minus 20%, 10%, 5%, 2%, and 1% available. See
Note 1
on page 3.
Internal metallurgical bond option available with “-1” suffix.
JAN, JANTX, and JANTXV qualification per MIL-PRF-19500/437 available (requires metallurgical
bond option as well as plus/minus 5% voltage tolerance or tighter with B-1, C-1 or D-1 suffix).
RoHS compliant versions available (commercial grade only).
DO-35 (DO-204AH)
Package
Also available in:
DO-213AA MELF
(surface mount)
1N5518BUR-1 thru
1N5546BUR-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Guaranteed voltage regulation (∆V
Z
) from I
ZL
to I
ZT
.
Voltage selection from 3.3 to 33 V.
Flexible axial-lead mounting terminals.
Nonsensitive to ESD per MIL-STD-750 Method 1020.
Minimal capacitance (see
Figure 3).
Inherently radiation hard as described in Microsemi “MicroNote
050”
which is available at
Microsemi.com.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(Note 1)
Steady-State Power
(Also see derating in
Figure 2)
Symbol
T
J
and T
STG
P
D
(Note 2)
Value
-65 to +175
0.5
250
300
1.1
260
Unit
o
C
W
Thermal Resistance Junction-to-Lead
(Note 3)
Thermal Resistance Junction-to-Ambient
Forward Voltage @ 200 mA
Solder Pad Temperature @ 10 s
R
ӨJL
R
ӨJA
V
F
T
SP
o
o
C/W
C/W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At T
L
< 50
o
C 3/8 inch (10 mm) from body or 0.48 W at T
A
< 25
º
C when mounted on FR4 PC board as
described for thermal resistance above.
2. At 3/8 (10 mm) lead length from body.
3. When mounted on FR4 PC board (1 oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25 mm.
T4-LDS-0037-1, Rev 1 (111456)
©2011 Microsemi Corporation
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