EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-01-2262-C

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AG-01-2262-C Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-01-2262-C - - View Buy Now

WBC-B0202AG-01-2262-C Overview

Resistor Networks & Arrays

WBC-B0202AG-01-2262-C Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics plc
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
Database development under wince5.0+evc4.0+sql ce solution
wince5.0 does not support ADOCE. Has anyone done database development under the wince5.0+evc4.0+sql ce solution? Please give me some advice....
lixiqin12345 Embedded System
Why do some designs connect dozens of capacitors in parallel?
Why do some designs connect dozens of capacitors in parallel to a network (power supply) with the same name instead of using a few capacitors with relatively large capacitance? I hope experts can give...
qq413243608 stm32/stm8
How to Become an Embedded Engineer (Serial)
[align=center][align=center][b][font=宋体][size=14pt][/size][/font][/b] [/align][/align][font=宋体][size=10.5pt]Thank you[/size][/font][font=宋体][size=10.5pt]! Now it's my turn. Many famous teachers have i...
bjfarsighttop Embedded System
Calculation of the volt-second capacity and primary coil turns of a dual-excitation switching power supply transformer Switching power supply principle and design (serial 54)
[b]2-1-1-5. Calculation of volt-second capacity and primary coil turns of dual-excitation switching power supply transformer[/b] In Figure 2-7, for the dual-excitation switching power supply transform...
noyisi112 Power technology
Development board, industrial computer help
I wrote an application on an ARM industrial control board (same as the development board). One of the tasks of the program is to keep printing information to the debug serial port. When it is set to t...
macro Embedded System
14. [Learning LPC1768 library functions] DAC experiment
DAC is a digital to analog converter (English: Digital to analog converter, English abbreviation: DAC) is a device that converts digital signals into analog signals (in the form of current, voltage or...
加勒比海盗 NXP MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 77  1104  1566  2793  576  2  23  32  57  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号