EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-01-6800-G

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-01-6800-G Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-01-6800-G - - View Buy Now

WBC-B0202AA-01-6800-G Overview

Resistor Networks & Arrays

WBC-B0202AA-01-6800-G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics plc
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
LCD Data Collection
Recently I found a website on the Internet, which has a lot of LCD information. I know it is very useful for experts. I would like to share it with you. Address: http://www.amobbs.com/thread-1566201-1...
qui26 Microcontroller MCU
I hope everyone can help!
The semaphore created in ucgui is used to lock and unlock. So how is the semaphore created when the gui is initialized used in multiple tasks? (For example, will the semaphore used by the task that re...
kakalin Embedded System
Design of the inverting input summing circuit
How to add the signal source U1 and the signal source U2? How to build an adder circuit? As shown in the picture below, the reverse summing circuit of the two input terminals is shown to you. It can b...
bqgup Creative Market
[Raspberry Pi Pico Review] 1. Testing the Raspberry Pi Pico without soldering the pin headers and analyzing the Pico's power circuit
First of all, I would like to thank EE for giving me the opportunity to test the Raspberry Pi Pico . In this review, I will learn and share two major contents.1. Hardware part: Learn about Raspberry P...
tagetage DIY/Open Source Hardware
***Network card driver error: FEC: No PHY device found****
I started UCLINUX on coldfire5272 (without using the DEBUG program, downloading the kernel to FLASH, and then moving it to memory for execution). As a result, the above error occurred when the FEC dri...
paulhwun Embedded System
Please advise how to avoid the microcontroller from being burned out
[align=left][color=rgb(0, 0, 0)][font=sans-serif]Today I tested the wiring of a microcontroller. I connected two identical boards. After powering on, the power light on one board was normal, but the p...
hanwenli123 Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2803  2890  1627  884  1337  57  59  33  18  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号