REVISIONS
LTR
A
B
C
DESCRIPTION
Changes in accordance with NOR 5962-R039-92. – sbr
Drawing updated to reflect current requirements. Editorial changes throughout. –
drw
Add case outline T. - drw
DATE (YR-MO-DA)
91-11-13
01-05-21
03-01-21
APPROVED
M. A. Frye
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Joseph A. Kerby
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
C
11
C
12
C
13
C
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
David H. Johnson
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-05-11
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUITS, LINEAR, 9 BIT A/D CONVERTER,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
C
SIZE
A
SHEET
CAGE CODE
67268
1 OF
14
5962-88532
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E189-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88532
01
X
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows:
Device type
01
Generic number
TDC1049
Circuit function
9-Bit A/D converter
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
T
U
X
Y
Z
Descriptive designator
See figure 1
CQCC2-J68
CDIP1-T64
See figure 1
CQCC1-N68
Terminals
68
68
64
64
68
Package style
quad flatpack
J-lead chip carrier
dual-in-line
dual-in-line
square leadless chip carried
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
V
EED
to D
GND
..........................................................................................................
V
EEA
to A
GND
..........................................................................................................
V
EEA
to V
EED
..........................................................................................................
A
GND
to D
GND
.........................................................................................................
V
IN
, V
RT
, or V
RB
to A
GND
.........................................................................................
CONV
or
CONV
to D
GND
.........................................................................................
V
RT
to V
RB
..............................................................................................................
Output short circuit duration .................................................................................
Storage temperature range...................................................................................
Lead temperature (soldering, 10 seconds)...........................................................
Power dissipation, worst case (P
D
).......................................................................
Thermal resistance, junction-to-case (θ
JC
):
Cases U, X and Z..............................................................................................
Case Y...............................................................................................................
Case T ...............................................................................................................
Junction temperature (T
J
) .....................................................................................
+0.5 V dc to -7.0 V dc
+0.5 V dc to -7.0 V dc
+0.5 V dc to -0.5 V dc
+1.0 V dc to -1.0 V dc
+0.5 V dc to V
EE
+0.5 V dc to V
EE
+2.5 V dc to -2.5 V dc
Indefinite
-65°C to +150°C
+300°C
6.07 W
See MIL-STD-1835
12°C/W
20°C/W
+175°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88532
SHEET
C
2
1.4 Recommended operating conditions.
Digital supply voltage to D
GND
(V
EED
) ....................................................................
Analog supply voltage to A
GND
(V
EEA
)...................................................................
Analog ground voltage to A
GND
(V
AGND
)................................................................
Supply voltage differential (V
EEA
- V
EED
) ...............................................................
CONV pulse width, low (t
PWL
)...............................................................................
CONV pulse width, high (t
PWH
) .............................................................................
CONV input voltage, common mode (V
ICM
) .........................................................
CONV input voltage, differential (V
IDF
)..................................................................
Most positive reference input (V
RT
) 1/ ..................................................................
Most negative reference input (V
RB
) 1/ ................................................................
Voltage reference differential (V
RT
- V
RB
) ..............................................................
Input voltage (V
IN
)..................................................................................................
Operating case temperature range (T
C
) ...............................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
-4.9 V dc to -5.5 V dc
-4.9 V dc to -5.5 V dc
-0.1 V dc to +0.1 V dc
-0.1 V dc to +0.1 V dc
12 ns minimum
15 ns minimum
-0.5 V dc to -2.5 V dc
+0.3 V dc to +1.2 V dc
-0.1 V dc to +0.1 V dc
-1.9 V dc to -2.1 V dc
1.8 V dc to 2.1 V dc
V
RB
to V
RT
-55°C to +125°C
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
1/ V
RT
must be more positive than V
RB
, and V
RT
– V
RB
must be within the specified range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88532
SHEET
C
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Block diagram. The logic diagram shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages
where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance
with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix
A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix
A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88532
SHEET
C
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
-1090
36
56
16
160
200
Unit
Supply current
Reference current
Total reference resistance 2/
Input equivalent resistance 2/
Input capacitance 2/
Input constant bias current
Digital input current (CONV,
CONV)
Output low voltage
Output high voltage
Digital input capacitance
2/
I
EE
I
REF
R
REF
R
IN
C
IN
I
CB
I
I
V
OL
V
OH
C
I
F
S
V
EED
= V
EEA
= -5.5 V
V
RT
= 0.0 V, V
RB
= -2.0 V,
V
EEA
, V
EED
= -5.5 V
V
RT
= 0.0 V, V
RB
= -2.0 V
V
RT
= 0.0 V, V
RB
= -2.0 V
V
RT
= 0.0 V, V
RB
= -2.0 V
V
IN
= 0.0 V, V
EEA
= V
EED
=
5.5 V
V
I
= 0.7 V, V
EEA
= V
EED
=
-5.5 V
V
EEA
, V
EED
= -4.9 V 3/
V
EEA
, V
EED
= -5.5 V 3/
T
A
= 25°C, f = 1.0 MHz
V
EEA
, V
EED
= -4.9 V
V
EEA
, V
EED
= -5.2 V, F
S
=
1.0 MSPS (check output
coding), see 4.3.1b
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
4, 5, 6
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
4
4, 5, 6
7, 8
9, 10, 11
3/
9, 10, 11
9, 10, 11
All
All
All
All
mA
mA
Ω
kΩ
pF
µA
µA
V
V
All
All
All
All
All
All
All
All
All
All
3.0
-2.0
30
-1.1
750
180
-1.5
20
pF
MSPS
4/
Maximum conversion rate 2/
Functional tests
Sampling time offset 2/
Digital output delay
Digital output hold time
See footnotes at end of table.
t
STO
t
D
t
HO
See figure 5
V
EEA
, V
EED
= -4.9 V
See figure 5
See figure 5
6.0
31
ns
ns
ns
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88532
SHEET
C
5
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