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5962-9318709H5X

Description
SRAM Module, 128KX32, 20ns, CMOS, CHIP66, CERAMIC, HIP-66
Categorystorage    storage   
File Size241KB,9 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

5962-9318709H5X Overview

SRAM Module, 128KX32, 20ns, CMOS, CHIP66, CERAMIC, HIP-66

5962-9318709H5X Parametric

Parameter NameAttribute value
package instructionCERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time20 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CHIP-P66
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal locationHEX
Base Number Matches1
WS128K32-XXX / EDI8C32128C
HI-RELIABILITY PRODUCT
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
s
Access Times of 15, 17, 20, 25, 35, 45, 55ns
s
MIL-STD-883 Compliant Devices Available
s
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)
• 68 lead, 40mm Low Profile CQFP, 3.56mm (0.140")
(Package 502), Package to be developed.
• 68 lead, 22.4mm Low Profile CQFP, 4.57mm (0.180"),
(Package 509)
s
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
s
Low Power Data Retention - only available in G2T/E
package type
s
s
s
s
s
Commercial, Industrial and Military Temperature Ranges
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s
Weight:
WS128K32-XG2TX / EDI8C32128C-E - 8 grams typical
WS128K32-XH1X / EDI8C32128C-G - 13 grams typical
WS128K32-XG4TX - 20 grams typical
s
All devices are upgradeable to 512Kx32
NOTE:
For non-SMD new designs, please use the WS128K32-
XXX part number for inquiries and orders.
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
AND EDI8C32128C-G
TOP VIEW
PIN DESCRIPTION
34
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
WE
1
CS
1
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
23
56
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
OE
A
0-16
I/O
22
I/O
21
128K x 8
128K x 8
128K x 8
128K x 8
I/O
20
66
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
August 1999 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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