CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specification
TA =40
o
C to 105
o
C, VIN = 0.5VCC, Unless Otherwise Specified
5
TVS DIODE ARRAYS
ESD Capability
ESD capability is dependent on the application and defined test
standard.The evaluation results for various test standards and methods
based on Figure 1 are shown in Table 1.
The SP723 has a Level 4 HBM capability when tested as a device to the
IEC 61000-4-2 standard. Level 4 specifies a required capability greater
than 8kV for direct discharge and greater than 15kV for air discharge.
For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-
circuit” method of ESD testing, the V+ and V- pins have a return path to
ground and the SP723 ESD capability is typically greater than 25kV from
100pF through 1.5kΩ. By strict definition of MIL-STD-3015.7 using “pin-
to-pin” device testing, the ESD voltage capability is greater than 10kV.
For the SP723 EIAJ IC121 Machine Model (MM) standard, the ESD capa-
bility is typically greater than 2kV from 200pF with no series resistance.
TABLE 1. ESD TEST CONDITIONS
STANDARD
IEC 1000-4-2
(Level 4)
TYPE/MODE
HBM, Air Discharge
HBM, Direct Discharge
R
D
C
D
±V
D
330Ω 150pF 15kV
330Ω 150pF
8kV
MIL-STD-3015.7 Modified HBM
Standard HBM
EIAJ IC121
Machine Model
R
1
CHARGE
SWITCH
C
D
H.V.
SUPPLY
°±V
D
R
D
1.5kΩ 100pF 25kV
1.5kΩ 100pF 10kV
0kΩ
200pF
2kV
DISCHARGE
SWITCH
IN
DUT
IEC 1000-4-2: R
1
50 to 100MΩ
MIL-STD-3015.7: R
1
1 to 10MΩ
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
w w w. l i t t e l f u s e . c o m
241
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
200
T
A
= 25
o
C
SINGLE PULSE
5
T
A
= 25
o
C
SINGLE PULSE
160
FORWARD SCR CURRENT (mA)
FORWARD SCR CURRENT (A)
4
120
3
80
2
I
FWD
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
V
FWD
40
1
0
600
800
1000
1200
0
0
1
2
3
FORWARD SCR VOLTAGE DROP (V)
FORWARD SCR VOLTAGE DROP (mV)
FIGURE 2. LOW CURRENT SCR FORWARD VOLTAGE DROP
CURVE
+V
CC
FIGURE 3. HIGH CURRENT SCR FORWARD VOLTAGE DROP
CURVE
+V
CC
INPUT
DRIVERS
OR
SIGNAL
SOURCES
LINEAR OR
DIGITAL IC
INTERFACE
IN 1 - 3
IN 5 - 7
TO +V
CC
V+
SP723
V-
SP723 INPUT PROTECTION CIRCUIT (1 OF 6 SHOWN)
FIGURE 4. TYPICAL APPLICATION OF THE SP723 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1V
BE
ABOVE V+ OR
LESS THAN -1V
BE
BELOW V-
242
w w w. l i t t e l f u s e . c o m
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
Peak Transient Current Capability of the SP723
The peak transient current capability rises sharply as the width of the
current pulse narrows. Destructive testing was done to fully evaluate the
SP723’s ability to withstand a wide range of peak current pulses vs time.
The circuit used to generate current pulses is shown in Figure 5.
The test circuit of Figure 5 is shown with a positive pulse input. For a
negative pulse input, the (-) current pulse input goes to an SP723 ‘IN’
input pin and the (+) current pulse input goes to the SP723 V- pin. The
V+ to V- supply of the SP723 must be allowed to float. (i.e., It is not tied
to the ground reference of the current pulse generator.) Figure 6 shows
the point of overstress as defined by increased leakage in excess of the
data sheet published limits.
The maximum peak input current capability is dependent on the ambient
temperature, improving as the temperature is reduced. Peak current
curves are shown for ambient temperatures of 25
o
C and 105
o
C and a 15V
power supply condition. The safe operating range of the transient peak
current should be limited to no more than 75% of the measured over-
stress level for any given pulse width as shown in the curves of Figure 6.
Note that adjacent input pins of the SP723 may be paralleled to improve
current (and ESD) capability. The sustained peak current capability is
increased to nearly twice that of a single pin.
+
V
X
R
1
VARIABLETIME DURATION
CURRENT PULSE GENERA
TOR
CURRENT
SENSE
(
-
)
(+)
1 IN
2 IN
3 IN
VOLTAGE
PROBE
R
1
~ 10Ω TYPICAL
V
X
ADJ. 10V/A TYPICAL
C1 ~ 100µF
4 V-
SP723
V+ 8
IN 7
IN 6
IN 5
C1
+
-
-
FIGURE 5. TYPICAL SP723 PEAK CURRENT TEST CIRCUIT
WITH A VARIABLE PULSE WIDTH INPUT
5
CAUTION: SAFE OPERA
TING CONDITIONS LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN ON EACH CURVE.
V+ TO V- SUPPLY = 15V
14
12
10
8
6
4
2
0
0.001
T
A
= 105
o
C
T
A
= 25
o
C
PEAK CURRENT (A)
0.01
0.1
1
PULSE WIDTH TIME (ms)
10
100
1000
FIGURE 6. SP723 TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWING THE MEASURED POINT OF OVERSTRESS IN
AMPERES vs PULSE WIDTH TIME IN MILLISECONDS
w w w. l i t t e l f u s e . c o m
243
TVS DIODE ARRAYS
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
Dual-In-Line Plastic Packages (PDIP)
N
E1
INDEX
AREA
1 2 3
N/2
-B-
-A-
D
BASE
PLANE
SEATING
PLANE
D1
B1
B
0.010 (0.25) M
D1
A
1
A2
L
A
C
L
E
(JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES
SYMBOL
A
A1
A2
MIN
-
0.015
0.115
0.014
0.045
0.008
0.355
0.005
0.300
0.240
MAX
0.210
-
0.195
0.022
0.070
0.014
0.400
-
0.325
0.280
MILLIMETERS
MIN
-
0.39
2.93
0.356
1.15
0.204
9.01
0.13
7.62
6.10
MAX
5.33
-
4.95
0.558
1.77
0.355
10.16
-
8.25
7.11
NOTES
4
4
-
-
8, 10
-
5
5
6
5
-
6
7
4
9
E8.3
-C-
B
B1
C
D
D1
E
e
A
e
C
C
e
C A B S
e
B
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and e
A
are measured with the leads constrained to be per-
pendicular to datum -C- .
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
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