Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1
OGN-SMD
OGN-SMD for increased solder
temperature with gold contacts
OGN-SMD equiped with fuse
OGN-SMD equiped with fuse
500 VAC · 4 W / 10 A (VDE) · 500 V · 16 A (UL/CSA)
Description
-
-
-
-
Approvals and Compliances
- For appliances in unattended use
Applications
References
Weblinks
- Household appliances
Packaging Details
pdf datasheet, html-datasheet, General Product Information, Packaging
details, Distributor-Stock-Check, Accessories, Detailed request for
product, Microsite
Unique Selling Proposition
Suitable for fully automated PCD assembling
Available with blister tape packaging
Small design height
Available preassembled with fuses
Technical Data
5 x 20 mm
PCB
Solder SMT
500 VAC (VDE), 500 V (UL/CSA)
16 A (VDE), 16 A (UL/CSA)
4 W / 10 A @ Ta 23 °C
2.5 W / 10 A with transparant cover, see
derating curves
Degree of Protection
IP 20 (with cover)
Protection Class
Suitable for appliances with protection
class I or II acc. to IEC 61140
Admissible Ambient Air Temp. -40 °C to 85 °C
Climatic Category
40/085/21 acc. to IEC 60068-1
Material: Socket
see variants
Material: Cover
Thermoplastic UL 94V-0
Material: Terminals
Tin-Plated Copper Alloy
Unit Weight
1.7 g
Storage Conditions
0 °C to 60 °C, max. 70% r.h.
Product Marking
, Type, Rated Voltage, Rated current,
Power Rating, Approvals
Fuse-Link
Mounting
Terminal
Rated Voltage
Rated current
Rated Power Acceptance IEC
Soldering Methods
Solderability
Contact Resistance
Dielectric Strength
Impulse Withstand Voltage
Insulation Resistance
Overvoltage Category
Pollution Degree
Reflow (lead-free)
Soldering Profile
245-260 °C / max. 30 sec acc. to JE-
DEC J-STD-020D
≤
10 mΩ at 20 mV acc. to IEC 60127-6
> 3 kV between Life parts
(50 Hz; 1 min)
> 4 kV between Life parts
≥
10 MΩ
(500 VDC; 1 min)
III acc. to IEC 60664-1
3 acc. to IEC 60664-1
Approvals and Compliances
Detailed information on product approvals, code requirements, usage instructions and detailed test conditions can be looked up in
Details about
Approvals
Approvals
The approval mark is used by the testing authorities to certify compliance with the safety requirements placed on electronic products.
Approval Reference Type: OGN-SMD
Approval Logo
Certificates
VDE Approvals
VDE Approvals
UL Approvals
Certification Body
VDE
VDE
UL
Description
VDE Certificate Number: 40001042
VDE Certificate Number: 40001042
UL File Number: E39328
Fuses
1
OGN-SMD
Product standards
Product standards that are referenced
Organization
Design
Designed according to
Designed according to
Designed according to
Standard
IEC 60127-6
UL 4248-1
CSA C22.2 no. 4248.1
Description
Fuseholder Blocks & Clips
https://www.schurter.com /PG02
Miniature fuses. Part 6. Fuse-holders for miniature fuse-links
Fuseholder general requirements
Fuseholder general requirements
Application standards
Application standards where the product can be used
Organization
Design
Designed for applications acc.
Designed for applications acc.
Standard
IEC/UL 60950
IEC 60335-1
Description
IEC 60950-1 includes the basic requirements for the safety of information
technologyequipment.
Safety of electrical appliances for household and similar purposes. Meets
the requirements for appliances in unattended use. This includes the en-
hanced requirements of glow wire tests acc. to IEC 60695-2-12 and -13.
Compliances
The product complies with following Guide Lines
Identification
Details
CE declaration of conformity
Initiator
SCHURTER AG
Description
The CE marking declares that the product complies with the applicable
requirements laid down in the harmonisation of Community legislation on
its affixing in accordance with EU Regulation 765/2008.
EU Directive RoHS 2011/65/EU
The law SJ / T 11363-2006 (China RoHS) has been in force since 1 March
2007. It is similar to the EU directive RoHS.
On 1 June 2007, Regulation (EC) No 1907/2006 on the Registration,
Evaluation, Authorization and Restriction of Chemicals 1 (abbreviated as
"REACH") entered into force.
RoHS
China RoHS
REACH
SCHURTER AG
SCHURTER AG
SCHURTER AG
Dimension [mm]
22.7 mm
25
9.6
Cover
13.2
11
10.8
6
12
6
Soldering pads
22.7
2
Fuses
Fuseholder Blocks & Clips
https://www.schurter.com /PG02
OGN-SMD
Derating Curves
Admissible Power Acceptance in Watt
With Transparent Cover
Admissible Power Acceptance in Watt
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
I = 1.0 I
n
I = 0.7 I
n
I = << I
n
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
I = 1.0 I
n
I = 0.7 I
n
I = < < I
n
Ambient Air Temperature T
a
°C
Ambient Air Temperature T
a
°C
Fuses
3
OGN-SMD
Order numbers for pre-assembled OGN-SMD, blister tape packaging with 400 pieces per reel
Rated
current In
FTT 5x20
with reflow cover
0853.0571
FTT 5x20
no cover
FST 5x20
with reflow cover
0853.0571
FST 5x20
no cover
FSF 5x20
with reflow cover
0853.0571
FSF 5x20
no cover
Fuseholder Blocks & Clips
https://www.schurter.com /PG02
SMD-SPT 5x20
SMD-SPT 5x20
with reflow cover no cover
0853.0571
50 mA
63 mA
80 mA
100 mA
125 mA
160 mA
200 mA
250 mA
315 mA
400 mA
500 mA
630 mA
800 mA
1A
1,25 A
1,6 A
2A
2,5 A
3,15 A
4A
5A
6,3 A
8A
10 A
0031.8501
0031.8502
0031.8503
0031.8504
0031.8505
0031.8506
0031.8507
0031.8508
0031.8509
0031.8510
0031.8511
0031.8512
0031.8513
0031.8514
0031.8515
0031.8516
0031.8517
0031.8518
0031.8519
0031.8551
0031.8552
0031.8553
0031.8554
0031.8555
0031.8556
0031.8557
0031.8558
0031.8559
0031.8560
0031.8561
0031.8562
0031.8563
0031.8564
0031.8565
0031.8566
0031.8567
0031.8568
0031.8569
0031.8304
0031.8305
0031.8306
0031.8307
0031.8308
0031.8309
0031.8310
0031.8311
0031.8312
0031.8313
0031.8314
0031.8315
0031.8316
0031.8317
0031.8318
0031.8319
0031.8320
0031.8321
0031.8322
0031.8323
0031.8324
0031.8325
0031.8326
0031.8327
0031.8354
0031.8355
0031.8356
0031.8357
0031.8358
0031.8359
0031.8360
0031.8361
0031.8362
0031.8363
0031.8364
0031.8365
0031.8366
0031.8367
0031.8368
0031.8369
0031.8370
0031.8371
0031.8372
0031.8373
0031.8374
0031.8375
0031.8376
0031.8377
0031.8413
0031.8414
0031.8415
0031.8416
0031.8417
0031.8418
0031.8419
0031.8420
0031.8421
0031.8422
0031.8423
0031.8424
0031.8425
0031.8426
0031.8463
0031.8464
0031.8465
0031.8466
0031.8467
0031.8468
0031.8469
0031.8470
0031.8471
0031.8472
0031.8473
0031.8474
0031.8475
0031.8476
0031.8993
0031.8994
0031.8995
0031.8996
0031.8997
0031.8998
0031.8999
0031.9000
0031.9001
0031.9002
0031.9003
0031.9007
0031.9008
0031.9009
0031.9010
0031.9011
0031.9012
0031.9013
0031.9014
0031.9015
0031.9016
0031.9017
All fuses in the pre-assembled OGN-SMD fuseholders are suitable for the reflow solder process.
4
Fuses
Fuseholder Blocks & Clips
https://www.schurter.com /PG02
OGN-SMD
All Variants
Holder
l
l
l
l
l
l
l
l
l
Material
Thermoplastic
Thermoplastic
Thermoplastic
Spec. Thermoplastic
Spec. Thermoplastic
Spec. Thermoplastic
Spec. Thermoplastic
Spec. Thermoplastic
Spec. Thermoplastic
Material: Terminals
Tin-Plated Copper Alloy
Tin-Plated Copper Alloy
Tin-Plated Copper Alloy
Tin-Plated Copper Alloy
Tin-Plated Copper Alloy
Tin-Plated Copper Alloy
Gold-Plated Copper Alloy
Gold-Plated Copper Alloy
Gold-Plated Copper Alloy
Reflow Condition
acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s
Packaging
Bulk 128 x 91 x 60 mm (100 pcs.)
Blister Tape 38 cm Reel (400 pcs.)
Blister Tray 266 x 174 mm (500 pcs.)
Bulk 128 x 91 x 60 mm (100 pcs.)
Blister Tape 38 cm Reel (400 pcs.)
Blister Tray 266 x 174 mm (500 pcs.)
Bulk 128 x 91 x 60 mm (100 pcs.)
Blister Tape 38 cm Reel (400 pcs.)
Blister Tray 266 x 174 mm (500 pcs.)
Order Number
0031.8221
0031.8225
0031.8222
0031.8263
0031.8265
0031.8264
0031.8273
0031.8275
0031.8274
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Most Popular.
Availability for all products can be searched real-time:https://www.schurter.com/en/Stock-Check/Stock-Check-SCHURTER
The fuseholder is suitable for use in equipment according to IEC 60335-1.
Fuseholders with gold-plated terminals are more heat resistant than fuseholders with tin-plated terminals.
If soldering problems occur with the thermoplastic version, it is recommended to use the spec. thermoplastic with tin-plated and gold-plated terminals.
Packaging Unit
Accessories
see variants
Description
Covers for OGN, OGN-SMD
Cover for Holder OGN, OGN-SMD
Adapter to OGN, OGN-SMD
Fuse Carriage with Handle for OGN, OGN-SMD
The specifications, descriptions and illustrations indicated in this document are based on current
information. All content is subject to modifications and amendments. Information furnished is believed
to be accurate and reliable. However, users should independently evaluate the suitability and test each
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