Surface Mount Fuses
Thin Film > 0402 Size > Very Fast-Acting > 435 Series
435 Series Fuse
Description
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E10480
029862_0_000
AMPERE RANGE
0.250 - 5.0A
0.250 - 5.0A
Electrical Characteristics for Series
% of Ampere
Rating
Opening Time at 25
O
C
Applications
Electrical Specifications by Item
Ampere
Rating
(A)
Amp
Code
Max
Voltage
Rating
(V)
Interrupting
Rating
Nominal Cold
Resistance
(Ohms)
Nominal
Melting
I t (A
2
sec)
Nom
Voltage
Drop
(mV)
Agency Approvals
Nom
Power
Dissipation
(W)
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/435.html for current information.
45
Revised: June 11, 2009
435 Series
435 Series
Surface Mount Fuses
Introduction to Circuit Protection
Transientology
Thin Film > 0402 Size > Very Fast-Acting > 435 Series
Temperature Rerating Curve
Average Time Current Curves
100
10
TIME IN SECONDS
1
0.1
0.01
0.001
0.1
.375A
.5A
.75A
1A
1.25A
1.5A
1.75A
2A
2.5A
3A
3.5A
4A
5A
1
10
CURRENT IN AMPERES
.25A
100
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
Temperature
Pre Heat
- Temperature Max (T
s(max)
)
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Wave Soldering
435 Series
46
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/435.html for current information.
Surface Mount Fuses
Thin Film > 0402 Size > Very Fast-Acting > 435 Series
Product Characteristics
Body:
Materials
Terminations:
Device Weight:
Operating
Temperature
Thermal Shock
Vibration
Terminal
Strength
Insulation
Resistance
Dimensions
Part Marking System
Marking code varies
with amperage.
Refer to Part Marking
System chart.
.991 +/- .051
(.039" +/- .002")
A
Amp
Code
.250
.375
.500
.750
001.
1.25
01.5
1.75
002.
02.5
003.
03.5
004.
005.
Marking
Code
B
.508 +/- .051
(.020" +/- .002")
.229 +/- .102
(.009" +/- .004")
C
.305 +/- .076
(.012" +/- .003")
D
.2159 +/- .0889
Sn
(.0085" +/- .0035")
Cu
Reflow solder
recommended
mounting pad
dimensions
.584
(.023")
.381
1.55
(.015") (.061")
.558
(.022")
Part Numbering System
0435 002. K R HF
A
B
C
D
SERIES
AMP Code
Example:
01.5
QUANTITY Code
PACKAGING Code
HALOGEN FREE ITEM
Packaging
Packaging Option
Packaging Specification
Quantity
Quantity &
Packaging Code
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/435.html for current information.
47
435 Series
435 Series
Introduction to Circuit Protection
Transientology
48
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
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