is measured by dividing the AC voltage drop across the device by the AC current supplied. AC frequency = 1.0 kHz.
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2
DF3A6.8FUT1
TYPICAL CHARACTERISTICS
100
t
r
100
VALUE (%)
PEAK VALUE — I
RSM
PULSE WIDTH (t
P
) IS
DEFINED AS THAT POINT
WHERE THE PEAK
CURRENT DECAYS TO
50%OF I
RSM
.
t
r
≤
10
ms
% OF PEAK PULSE CURRENT
90
80
70
60
50
40
30
20
10
0
0
1
2
3
t, TIME (ms)
4
0
0
20
40
t, TIME (ms)
60
80
t
P
t
r
PEAK VALUE I
RSM
@ 8
ms
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8
ms
HALF VALUE I
RSM
/2 @ 20
ms
50
t
P
I
RS
HALF VALUE —
2
M
Figure 1. 10
×
1000
ms
Pulse Waveform
Figure 2. 8
×
20
ms
Pulse Waveform
20.01
18.01
I ZT, ZENER CURRENT (mA)
16.01
14.01
12.01
10.01
8.01
6.01
4.01
2.01
0
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
I F , FORWARD CURRENT (mA)
REVERSE VOLTAGE IS
MEASURED WITH A PULSE
TEST CURRENT I
T
AT 25°C
200
180
160
140
120
100
80
60
40
20
0
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
FORWARD VOLTAGE IS
MEASURED WITH A PULSE
TEST CURRENT I
F
AT 25°C
V
Z
, ZENER VOLTAGE (V)
V
F
, FORWARD VOLTAGE (V)
Figure 3. Zener Voltage vs. Zener Current
Figure 4. Forward Voltage vs. Forward
Current
100
90
C, CAPACITANCE (pF)
80
70
60
50
40
30
20
10
0
0
1
2
3
4
V, BIAS VOLTAGE (V)
300
PD , POWER DISSIPATION (mW)
f = 1 MHz
T
A
= 25°C
250
200
150
100
50
0
0
25
50
75
100
125
150
175
UniDirectional Pin 1/2−3
BiDirectional Pin 1−2
5
6
T
A
, AMBIENT TEMPERATURE (°C)
Figure 5. Capacitance vs. Bias Voltage
Figure 6. Steady State Power Derating Curve
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3
DF3A6.8FUT1
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE L
A
L
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
G
H
J
K
L
N
S
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.032
0.040
0.012
0.016
0.047
0.055
0.000
0.004
0.004
0.010
0.017 REF
0.026 BSC
0.028 REF
0.079
0.095
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.00
0.30
0.40
1.20
1.40
0.00
0.10
0.10
0.25
0.425 REF
0.650 BSC
0.700 REF
2.00
2.40
S
1
2
B
D
G
C
0.05 (0.002)
N
K
J
H
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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