Technical Data
4341
Effective October 2015
Supersedes September 2010
FP1007
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
•
Servers
Multi-phase and Vcore regulators
Voltage Regulator Modules (VRMs)
Desktop VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
DCR Sensing circuits
Product description
•
•
•
•
•
•
Environmental data
•
High current carrying capacity
Low core loss
Frequency range up to 2MHz
Inductance Range from 115 nH to 300nH
Current range from 32 to 94 amps
10.4 x 8.0mm footprint surface mount package
in 6.5, 7.5 or 7.5mm height
Ferrite core material
Halogen free, lead free, RoHS compliant
Storage temperature range (Component):
-40°C to +125°C
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
Solder reflow temperature:
J-STD-020D compliant
•
•
•
•
Pb
HF
FREE
HALOGEN
Technical Data
4341
Effective October 2015
FP1007
High frequency, high current power inductors
Product specifications
OCL
1
(nH)±10%
FLL
2
(nH) minimum
I
rms3
(amps)
I
sat
1
4
(amps)
I
sat
2
5
(amps)
DCR (mΩ)
@ 20°C ±5%
Part Number
7
K-factor
8
R1 version
FP1007R1-R12-R
FP1007R1-R14-R
FP1007R1-R17-R
FP1007R1-R22-R
FP1007R1-R30-R
R2 version
FP1007R2-R12-R
FP1007R2-R14-R
FP1007R2-R17-R
FP1007R2-R22-R
FP1007R2-R30-R
R3 version
FP1007R3-R12-R
FP1007R3-R15-R
FP1007R3-R17-R
FP1007R3-R22-R
FP1007R3-R23-R
FP1007R3-R27-R
FP1007R3-R30-R
115
150
175
215
230
270
300
83
108
126
155
165
194
216
61
61
61
61
61
61
61
94
76
66
50
48
40
35
86
70
60
43
40
34
30
0.29 ± 5%
0.29 ± 5%
0.29 ± 5%
0.29 ± 5%
0.29 ± 5%
0.29 ± 5%
0.29 ± 5%
354
354
354
354
354
354
354
120
140
170
215
300
86
100
122
155
216
51
51
51
51
51
81
72
58
50
32
65
56
46
36
26
0.48 ± 8%
0.48 ± 8%
0.48 ± 8%
0.48 ± 8%
0.48 ± 8%
368
368
368
368
368
120
140
170
215
300
86
100
122
155
216
60
60
60
60
60
81
72
58
50
32
65
56
46
36
26
0.29 ± 10%
0.29 ± 10%
0.29 ± 10%
0.29 ± 10%
0.29 ± 10%
371
371
371
371
371
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I
sat
1, +25°C
3. I
rms
: Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25°C
5. I
sat
2: Peak current for approximately 20% rolloff @ +125°C
6. K-factor: Used to determine B
p-p
for core loss (see graph).
B
p-p
= K * L *
∆I
* 10
-3
. B
p-p
:(Gauss), K: (K-factor from table),
L: (Inductance in nH),
∆I
(Peak-to-peak ripple current in Amps).
7. Part Number Definition: FP1007Rx-Rxx-R
FP1007R= Product code and size
x = DCR indicator
Rxx = Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Recommended Pad Layout
Schematic
Part marking: FP1007Rx (x = DCR indicator), Rxx (xx = inductance value in
uH, R = decimal point, wwllyy = date code, R = revision level
Tolerances are ±0.25 millimeters unless stated otherwise.
PCB tolerances are ±0.1 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1 millimeter
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
2
www.eaton.com/elx
FP1007
High frequency, high current power inductors
Packaging information (mm)
Supplied in tape and reel packaging,
FP1007R1 700 parts per 13 ” diameter reel
FP1007R2 750 parts per 13 ” diameter reel
FP1007R3 650 parts per 13 ” diameter reel
Technical Data
4341
Effective October 2015
User direction of feed
Temperature rise vs. total loss
www.eaton.com/elx
3
Technical Data
4341
Effective October 2015
FP1007
High frequency, high current power inductors
Core loss vs. B
p-p
Inductance characteristics
4
www.eaton.com/elx
FP1007
High frequency, high current power inductors
Solder reflow profile
Technical Data
4341
Effective October 2015
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4341 BU-10927
October 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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