TDK-EPC Technology
SPM5012-CA Series
Features
SMD Power Inductor
Component Image & Dimension
1.2mm max
a) Small Footprint and Low Profile Design :
Footprint : 5.4 x 5.1 mm Typ.
Height :
1.2mm Max.
b) High Power Handling Capability :
Small Copper Loss
Using Large Saturation Induction of
Fe- based metals
c) Wide Range Operating Temperature due to
High Curie Temperature
d) Automatic Mounting in Tape&Reel Package.
5.4±0.2mm
5.1±0.2mm
Applications
Note Book & Mobile Computer, VRM,
Cellular Phone, HDD etc.
Electrical Specification
TDK Identification
SPM5012T- 1R0M-CA
SPM5012T- 2R2M-CA
Note.
Inductance
at 0A
Tol.
(uH)
(％)
+/-20%
+/-20%
Test
Freq.
(kHz)
DC Resistance
Typ.
Spec.
(m-Ohm)
(m-Ohm)
Rated DC Current
Idc 1
Idc 2
(A) max.
(A） typ.
(A） typ.
1.0
2.2
100
100
44.0 max
78.8 max
40.0
71.6
6.3
4.9
7.9
6.1
4.1
2.7
Idc 1 : Based on the inductance change.( -30% Reduction from Nominal L Value )
Idc 2 : Based on the self temperature rise. (+40 deg typ.)
Operating Temperature Range: -40
℃½
+125
℃
(including self temperature rise)
Caution: Please contact our sales person when you consider organic solvent or aqueous cleaning.
Inductance
½½
.DC Superposition
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
1
2
3
4
Idc (A)
5
6
7
1R0
2R2
Recommended pad layout
1.4
3.0
1.4
L (uH)
8
2.5
as of 2014, Feb
MCU
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