BMI-S-226-F datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> BMI-S-226-F

BMI-S-226-F: DescriptionEMI Gaskets, Sheets & Absorbers BMI-S-226 Frame 1.375" x 2.8"; CategoryPassive components; File Size21MB，117 Pages; ManufacturerLSR

Download Datasheet Parametric View All

BMI-S-226-F Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BMI-S-226-F	-	-	View	Buy Now

BMI-S-226-F Overview

EMI Gaskets, Sheets & Absorbers BMI-S-226 Frame 1.375" x 2.8"

BMI-S-226-F Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	LSR
Product Category	EMI Gaskets, Sheets & Absorbers
RoHS	Details
Product	Shields
Type	Open Frame Shields & Enclosures
Mounting Style	SMD/SMT
Factory Pack Quantity	100

Preview

Download Datasheet

View All

EMI

L O G

CATA

www.lairdtech.com

EMI ESSENTIALS

EMI INTRODUCTION

Overview of EMC/RFI Issues

The phenomenon of electromagnetic interference (EMI) is familiar to virtually everyone, even if they do not

understand the underlying principles. Most people have witnessed firsthand the effects of interference.

To control EMI, government organizations, such as the FCC, CSA, and EEC, mandate that manufacturers may

not design, produce or sell electronic equipment that jams the public broadcast services. In other instances,

however, EMI can constitute more than a mere nuisance. The military and medical communities, for example,

require trouble-free operation of their electronic equipment in adverse electromagnetic environments since

malfunctions could jeopardize missions and personnel. The European Union’s EMC directive also mandates

that “the apparatus has an adequate level of intrinsic immunity to electromagnetic disturbance to enable it

to operate as intended”.

EMC Design of High Speed Systems

The interference and susceptibility (immunity) effects of electronic apparatus are created by time-variant

electromagnetic fields which may be propagated along a conducting medium or by radiation through space.

Because the source of the conducted and radiated interference energy levels may be related, a coordinated

systems design effort is required to reduce these effects.

A design program for an equipment item that must meet both an emission and an immunity requirement

consists of:

• Suppression: Reducing the interference at its source.

• Isolation: Isolating the offending circuits by filtering, grounding and shielding.

• Desensitization: Increasing the immunity of any susceptible circuits.

These three steps should be carried on throughout the entire equipment design and implemented as early

as possible within the design program.

Effects of Logic Speed

The trend in today’s electronic devices is faster, smaller, and digital rather than analog. Most equipment

(95%) of today contains digital circuits. Today’s digital designer must create a circuit board that has the

lowest possible EMI, combined with the highest possible operating/processing speeds. Design of the PCB

is the most critical EMC influencing factor for any system, since virtually all active devices are located on

the board. It is the changing current (accelerated electron movement) produced by the active devices that

result in EMI.

Design Approaches

There are two approaches that can be used to reduce the emission from the PC board. The first approach is

to operate the circuit at the slowest speeds consistent with the functionality of the system, lay out the PCB

with the smallest possible loop areas (especially the high speed devices), and insert suppression components

such as filters, ferrite beads, and bypass capacitors into the circuit to reduce its bandwidth. These techniques

will result in a desired decrease in the high frequency harmonic amplitudes and circuit bandwidth and a

corresponding undesired decrease in both the operating speed and system reliability. The use of slower

speeds with reduced bandwidth will help to desensitize the circuit to external susceptibility fields.

The second is to use shielding. Shielding is the only non-invasive suppression technique. Since the shielding

is not inserted into the circuit, it does not affect the high frequency operating speed of the system, nor does

it affect the operation of the system should changes be made to the design in the future. In addition,

shielding does not create timing problems and waveform distortion; it does not decrease system reliability;

and it reduces crosstalk. Plus, shielding works for both emission suppression as well as susceptibility

(immunity) problems.

Even with the overall advantages of shielding, the most cost-effective approach is to use a combination

of circuit suppression/hardening and shielding.

www.lairdtech.com

Recommended Resources

MAX225-RS232 multi-channel data interface circuit (driver-receiver)

Low voltage linear regulator LR602

Several soft start circuits-a

Planar gas discharge tube static drive circuit

A method for wiring the active power meter for measuring single-phase electrical appliances

Computer motherboard circuit diagram 810 3_19

How to generate static library .a in ADS: How do I generate a static library (.a file) using ADS1.2? What is the format of the exported function? How do I call the function in the generated .a file? I am a beginner in ADS and I can't find any...; suo618 Embedded System

[In-depth evaluation of STM32 Nucleo] + development experience and stage summary: [i=s]This post was last edited by fyaocn on 2014-12-15 12:25[/i] Because of other work, the test was intermittent, so the posts in the middle were also very simple, just for demonstration. However, I ...; fyaocn stm32/stm8

How to change the SinA332.0 development board from VGA output to LCD output: [size=5][backcolor=rgb(222, 240, 251)]Allwinner A33 processor supports Android 4.4 and 6.0 versions[/backcolor][/size] [backcolor=rgb(222, 240, 251)]Because the default configuration in the system sou...; babyking Embedded System

High-frequency contactless smart card terminal creative progress post + AltiumDesigner schematic diagram: High-frequency contactless smart card terminal creative progress post + AltiumDesigner schematic diagram...; gxliu08 Renesas Electronics MCUs

Looking at the component list of the Zhejiang Electronic Design Competition, can you guess what questions can be asked?: [i=s]This post was last edited by paulhyde on 2014-9-15 03:15[/i][table=98%] [tr][td][/td][td][/td][td][/td][td][/td][/tr] [tr][td=1,10,100][align=center]Power supply[/align][/td][td=1,2,198][align=ce...; 云弋sky Electronics Design Contest

Several ways to write clock and reset in Testbench: For example: 1. Ordinary clock signal ( 1 ) initial statement parameter FAST_PERIOD=10;// Generate a clock with a period of 10 reg Clock; initial begin Clock=0; forever # (FAST_PERIOD/2) Clock=~Clock;...; 似水如烟 FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components