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BM20B06-20DS-04V53

Description
Board to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.6mm H 0.4mm P VSMT
CategoryThe connector   
File Size2MB,12 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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BM20B06-20DS-04V53 Overview

Board to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.6mm H 0.4mm P VSMT

BM20B06-20DS-04V53 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerHirose
Product CategoryBoard to Board & Mezzanine Connectors
RoHSDetails
ProductReceptacles
Number of Positions20 Position
Pitch0.4 mm
Number of Rows2 Row
Termination StyleSMD/SMT
Mounting AngleStraight
Current Rating300 mA
Voltage Rating30 V
PackagingCut Tape
PackagingMouseReel
PackagingReel
ApplicationBoard to Board
Contact PlatingGold
Housing MaterialLiquid Crystal Polymer (LCP)
Contact MaterialPhosphor Bronze
Flammability RatingUL 94 V-0
Insulation Resistance50 MOhms
Stack Height0.6 mm
Factory Pack Quantity1000
0.4 mm Pitch, 0.6 and 0.8 mm Height, Board-to-Board and Board-to-FPC Connectors
BM20 Series
■Receptacle
Existing products
BM20
2.3mm
2.98mm
2.46mm
10.4mm
10.48mm
Mar.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
A 22.3%
reduction
Existing products
in size!
BM20
2.98 ∞ 10.4
=About 31.0mm
2
2.3 ∞ 10.48
= About 24.1mm
2
■Header
Existing products
BM20
■Features
1. High density mounting capability
A space saving design that keeps the connector
compact, but still maintains an adequate vacuum
area (no less than 0.7mm wide).
Depth DS: 2.3 mm DP: 1.78 mm
9.32mm
9.4mm
Board occupied area
A 27.1%
reduction
Existing products
in size!
2. Reliable contact performance
Even though the mated height is low, the BM20 still
leads it class in maximum effective mating lengths
for each mating height.
<Effective Mating Length>
Height 0.8 mm: 0.2 mm
Height 0.6 mm: 0.15 mm
The addition of the two point contact system adds
more reliability to the contacts.
BM20
2.46 ∞ 9.32
= About 22.9mm
2
1.78 ∞ 9.4
= About 16.7mm
2
Vaccum pick-up
3. No restrictions to PCB pattern design
for the 0.8 mm height connector
*1
This series utilizes a thin wall to insulate the
bottom surface of the connector and maintains an
effective mating length of 0.2 mm. This removes
any restriction for PCB pattern layout design
under the connector.
Note *1: There are some restrictions for the 0.6
mm height style.
Mating diagram (cross section)
H=0.8
2-point contact
structure
Molded Bottom
surface structure
4. Enhanced mating operations
The structure uses guide ribs to ease the mating
process and offers a self alignment range of up to
0.3 mm. A clear tactile click is used as an
indicator to the user that the mating process was
completed.
5. Drop and shock resistant structure
Dimples were designed into the contacts to
increase their retention force and to absorb the
shock delivered from a drop or other impact.
6. Debris resisting design
When mated, the connector’s design covers the
contacts which help to keep dust and other debris
away from the contacts. The SMT leads are kept
very close to the connector housing which also
helps to prevent shorts caused by debris on the
exposed contacts
H=0.6
Molded Bottom
surface structure
1.78
mm
2013.11②
1

BM20B06-20DS-04V53 Related Products

BM20B06-20DS-04V53 BM20B06-50DP-04V51 BM20B08-34DS-04V53
Description Board to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.6mm H 0.4mm P VSMT Board to Board & Mezzanine Connectors 50P DR HDR B2B/B2FPC 0.6mm H 0.4mm P VSMT Board to Board & Mezzanine Connectors 34P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSMT
Product Attribute Attribute Value Attribute Value Attribute Value
Manufacturer Hirose Hirose Hirose
Product Category Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors
RoHS Details Details Details
Product Receptacles Headers Receptacles
Factory Pack Quantity 1000 8000 1000
Number of Positions 20 Position - 34 Position
Pitch 0.4 mm - 0.4 mm
Number of Rows 2 Row - 2 Row
Termination Style SMD/SMT - SMD
Mounting Angle Straight - Vertical
Current Rating 300 mA - 300 mA
Voltage Rating 30 V - 30 V
Packaging Reel Reel Reel
Housing Material Liquid Crystal Polymer (LCP) - Liquid Crystal Polymer (LCP)
Insulation Resistance 50 MOhms - 50 MOhms
Stack Height 0.6 mm - 0.8 mm
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