of input to output isolation, and features an ultra-low
on-resistance for high-current operation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Offering the superior reliability associated with
semiconductor devices, the LCA715 can be used to
replace mechanical relays. Because it has no moving
parts, it can offer faster, bounce-free switching in a
more compact surface mount or thru-hole package.
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN/IEC 60950:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LCA715
LCA715S
LCA715STR
Description
6 Pin DIP (50/Tube)
6 Pin Surface Mount (50/Tube)
6 Pin Surface Mount (1000/Reel)
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Versions Available
Applications
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
+ Control
- Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
Switching Characteristics
of Normally Open Devices
Form-A
I
F
DC Only Configuration
90%
+ Control
- Control
Do Not Use
1
2
3
6
5
4
+ Load
- Load
I
LOAD
t
on
10%
t
off
Pb
DS-LCA715-R06
e
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation
1
ESD, Human Body Model
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
LCA715
Ratings
60
5
50
1
70
800
8
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
kV
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 6.67 mW / ºC
Electrical Characteristcs @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance
1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
Continuous, Free Air
t<10ms
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
0.12
0.038
-
0.7
0.115
110
60
0.9
-
1.2
-
3
2.2
4
±10
0.15
0.05
1
2.5
0.25
200
-
5
-
1.4
10
-
A
rms
/ A
DC
A
DC
A
P
A
ms
ms
I
F
=5mA, I
L
=1A
I
F
=0mA, V
L
=60V
P
I
F
=5mA, V
L
=10V
I
F
=0mA, f=1MHz
V
L
=10V
V
L
=50V
I
L
=1A
-
I
F
=5mA
V
R
=5V
-
pF
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
mA
mA
V
A
pF
Measurement taken within 1 second of on-time.
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
LCA715
30
25
Device Count (N)
20
15
10
5
0
20
Typical Turn-On Time Distribution
(N=50, I
F
=5mA, I
L
=100mA)
Typical Turn-Off Time Distribution
(N=50, I
F
=5mA, I
L
=100mA)
25
20
15
10
5
0
Device Count (N)
15
10
5
0
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
Device Count (N)
0.55
0.60
0.65 0.70 0.75 0.80
Turn-On Time (ms)
0.85
0.109 0.111 0.113 0.115 0.117 0.119 0.121
Turn-Off Time (ms)
30
25
Typical I
F
for Switch Operation
(N=50, I
L
=100mA)
30
25
Device Count (N)
20
15
10
5
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=1A)
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
20
15
10
5
0
0.7
0.8
0.9
1.0
LED Current (mA)
1.1
0
0.110
0.111 0.112 0.113 0.114
On-Resistance ( )
0.115
Device Count (N)
Device Count (N)
81
82
83
84
85
86
Blocking Voltage (V
P
)
87
Typical LED Forward Voltage
vs. Temperature
1.6
LED Forward Voltage (V)
2.0
Turn-On Time (ms)
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA)
0.120
0.115
0.110
0.105
0.100
0.095
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA)
1.4
1.3
1.2
1.1
-40
1.2
0.8
0.4
0.0
Turn-Off Time (ms)
1.5
1.6
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30
40
LED Forward Current (mA)
50
0
10
20
30
40
LED Forward Current (mA)
50
1.3
1.2
LED Current (mA)
1.1
1.0
0.9
0.8
0.7
-40
LED Current to Operate
vs. Temperature
(I
L
=1A)
Turn-On Time (ms)
0.8
0.7
0.6
0.5
0.4
0.3
Turn-On Time vs. Temperature
(I
L
=100mA)
I
F
=5mA
Turn-Off Time (ms)
0.15
0.14
0.13
0.12
0.11
0.10
0.09
0.08
-40
Turn-Off Time vs. Temperature
(I
L
=100mA)
I
F
=5mA
I
F
=10mA
I
F
=10mA
-20
0
20
40
60
Temperature (ºC)
80
100
0.2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
On-Resistance vs. Temperature
(I
F
=5mA, I
L
=1A)
LCA715
0.16
0.15
On-Resistance ( )
0.14
0.13
0.12
0.11
0.10
0.09
-40
4.0
3.5
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
3
2
Load Current (A)
1
0
-1
-2
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
Load Current (A)
3.0
2.5
2.0
1.5
1.0
0.5
-20
0
20
40
60
Temperature (ºC)
80
100
0.0
0.00
0.02
0.04 0.06 0.08 0.10
Load Voltage (V)
0.12
0.14
-3
-0.3
-0.2
-0.1
0.0
0.1
Load Voltage (V)
0.2
0.3
4.5
4.0
Load Current (A)
3.5
3.0
2.5
2.0
Maximum Load Current
vs. Temperature
(I
F
=5mA)
DC-Only Configuration
Blocking Voltage (V
P
)
Blocking Voltage vs. Temperature
88
Leakag Current ( A)
0.020
Typical Leakage vs. Temperature
(V
L
=60V)
86
84
82
80
78
-40
0.015
0.010
AC/DC Configuration
1.5
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.005
-20
0
20
40
60
Temperature (ºC)
80
100
0.000
-40
-20
0
20
40
60
Temperature (ºC)
80
100
240
Output Capacitance (pF)
200
160
120
80
40
Output Capacitance vs. Load Voltage
( I
F
=0mA, f=1MHz)
Energy Rating Curve
11
10
Load Current (A)
9
8
7
6
5
4
3
2
10 s 100 s 1ms 10ms 100ms
Time
0
10
20
30
40
Load Voltage (V)
50
60
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R06
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NTEGRATED
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Manufacturing Information
Moisture Sensitivity
LCA715
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCA715 / LCA715S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCA715 / LCA715S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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