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5962-9461107HTX

Description
SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size577KB,11 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9461107HTX Overview

SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

5962-9461107HTX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
JESD-609 codee4
length27.3 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height4.6 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width27.3 mm
Base Number Matches1
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)
1
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880") square (Package 510) 3.56mm
(0.140") height.
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880") square, 5.08mm (0.200") high
(Package 528).
WS512K32-XXX
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX
1
- 20 grams typical
WS512K32-XG2LX - 8 grams typical
* This product is subject to change without notice.
Note 1: Package Not Recommended For New Design
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
18
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
I/O
0 - 7
I/O
8 - 15
I/O
16 - 23
I/O
24 - 31
WE
1
# CS
1
#
OE#
A
0-18
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
512K X 8
512K X 8
512K X 8
512K X 8
8
8
8
8
May 2006
Rev. 17
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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