closed (1-Form-B) solid state relay in a 4-pin SOP
package that employs optically coupled MOSFET
technology to provide 1500V
rms
of input-to-output
isolation. The optically coupled outputs, which use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
The device is compliant with supplementary isolation
in accordance with EN/IEC 60950-1.
IXYS Integrated Circuits Division’s state of the art
double molded vertical construction packaging
enables the CPC1231N to be one of the world’s
smallest 4-pin relays, which offers board space
savings approaching 20% over the competitor’s
larger 4-pin SOP relay.
Approvals
•
UL 1577 Approved Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC1231N
CPC1231NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Features
•
0.4mm Distance Through Insulation
(Supplementary Isolation Requirement of
EN60950)
•
1500V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 4-Pin SOP Package
•
Machine Insertable, Wave Solderable
•
Tape & Reel Version Available
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket
Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment
Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
+ Control
1
4
Load
– Control
2
3
Load
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
I
LOAD
10%
t
off
t
on
90%
Pb
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation
1
Capacitance, Input to Output
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
CPC1231N
Ratings
350
5
50
1
150
400
1
1500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
pF
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Voltage Drop
Reverse Input Current
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
-
t =10ms
I
L
=120mA
I
F
=2mA, V
L
=350V
P
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=120mA
I
F
=5mA
V
R
=5V
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
V
F
I
R
-
-
-
-
-
-
-
-
0.9
-
-
-
25
-
-
-
25
0.6
1.2
-
120
±350
30
5
2
2
-
2
1.4
10
mA
rms
/ mA
DC
mA
P
A
ms
pF
mA
V
A
Load current derates linearly from 120mA @ 25
o
C to 80mA @ 85
o
C.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60°C) a LED drive current of 5mA is recomended.
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PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA, T
A
=25ºC)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
0.21
0.22
LED Forward Voltage Drop (V)
0.23 0.24 0.25
Turn-On (ms)
0.26
0.27
25
20
15
10
5
0
0.50
0.60
0.70
0.80
CPC1231N
35
30
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA, T
A
=25ºC)
Device Count (N)
Device Count (N)
25
20
15
10
5
0
Device Count (N)
0.90
1.00
1.10
Turn-Off (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=120mA, T
A
=25ºC)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA, T
A
=25ºC)
Typical On-Resistance Distribution
(N=50, I
L
=120mA, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
Device Count (N)
Device Count (N)
0.45
0.50
0.55 0.60 0.65
LED Current (mA)
0.70
0.75
0.45
0.50
0.55 0.60 0.65
LED Current (mA)
0.70
0.75
23.5
24
24.5
25
25.5
26
26.5
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
395
400
405
410
415
420
425
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Turn-On (ms)
0.7
0.6
Typical Turn-On
vs. LED Forward Current
(I
L
=120mA)
Typical Turn-Off
vs. LED Forward Current
(I
L
=120mA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Turn-Off (ms)
0.5
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PERFORMANCE DATA*
Typical Turn-On vs. Temperature
(I
L
=50mA)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
CPC1231N
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
Typical Turn-Off vs. Temperature
(I
L
=50mA)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=50mA)
Turn-On (ms)
Turn-Off (ms)
I
F
=5mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
80
100
Temperature (ºC)
I
F
=10mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
40
On-Resistance ( )
35
Typical On-Resistance
vs. Temperature
(I
F
=0mA, I
L
=120mA)
Typical Load Current vs. Load Voltage
(I
F
=0mA, T
A
=25ºC)
150
Load Current (mA)
Load Current (mA)
100
50
0
-50
-100
-150
-6
-4
-2
0
2
Load Voltage (V)
4
6
180
160
140
120
100
80
60
40
20
0
-40
-20
Maximum Load Current
vs. Temperature
(I
F
=0mA)
30
25
20
15
10
-40
-20
0
20
40
60
80
100
Temperature (ºC)
0
20
40
60
80
100
120
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
425
Blocking Voltage (V
P
)
420
Leakage ( A)
415
410
405
400
395
390
-40
-20
0
20
40
60
80
100
Temperature (ºC)
0.016
0.014
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(I
F
=2mA, V
L
=350V)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
80
100
Load Current (A)
0.012
1s
10s 100s
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
CPC1231N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1231N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1231N
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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