MP02 XX 130 Series
MP02 XX 130 Series
Dual Diode Modules
Replaces December 1998 version, DS5100-3.0
DS5100- January 2000
FEATURES
s
Dual Device Module
s
Electrically Isolated Package
s
Pressure Contact Construction
s
International Standard Footprint
s
Alumina (non-toxic) Isolation Medium
Code
HB
KEY PARAMETERS
2500V
V
RRM
I
FSM
2200A
130A
I
F(AV)
(per arm)
V
isol
2500V
CIRCUIT OPTIONS
Circuit
APPLICATIONS
s
Rectifier Bridges
s
DC Power Supplies
s
Plating Rectifiers
s
Traction Systems
VOLTAGE RATINGS
Type
Number
Repetitive
Peak
Voltages
V
RRM
2500
2200
2000
1800
Conditions
G
GN
PACKAGE OUTLINE
MP02/130 - 25
MP02/130 - 22
MP02/130 - 20
MP02/130 - 18
T
vj
= 150
o
C
I
RM
= 30mA
V
RSM
= V
RRM
+ 100V
Lower voltage grades available. For full description of
part number see "Ordering Instructions" on page 3.
Module outline type code: MP02.
See Package Details for further information
CURRENT RATINGS - PER ARM
Symbol
Parameter
Conditions
T
case
= 75
o
C
T
case
= 85
o
C
I
F(AV)
Mean forward current
Halfwave, resistive load
T
heatsink
= 75
o
C
T
heatsink
= 85
o
C
I
F(RMS)
RMS value
T
case
= 75
o
C
Max.
130
116
114
101
204
Units
A
A
A
A
A
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MP02 XX 130 Series
SURGE RATINGS - PER ARM
Symbol
I
FSM
Parameter
Surge (non-repetitive) on-state current
Conditions
10ms half sine;
T
j
= 150
o
C
10ms half sine;
T
j
= 150
o
C
V
R
= 0
V
R
= 50% V
RRM
V
R
= 0
V
R
= 50% V
RRM
Max.
2200
1760
24200
15490
Units
A
A
A
2
s
A
2
s
I
2
t
I
2
t for fusing
THERMAL & MECHANICAL RATINGS
Symbol
Parameter
dc
R
th(j-c)
Thermal resistance - junction to case
per Diode
halfwave
3 phase
R
th(c-hs)
T
vj
T
sto
V
isol
Thermal resistance - case to heatsink
per Diode
Virtual junction temperature
Storage temperature range
Isolation voltage
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Mounting torque = 6Nm
with mounting compound
Conditions
Max.
0.37
0.38
0.39
0.07
150
-40 to 150
2.5
Units
o
C/W
C/W
C/W
C/W
o
o
o
o
C
C
o
kV
CHARACTERISTICS
Symbol
V
FM
I
RM
V
TO
r
T
Parameter
Forward voltage
Peak reverse current
Threshold voltage
On-state slope resistance
Conditions
At 300A , T
case
= 25
o
C
At V
RRM
, T
j
= 150
o
C
At T
vj
= 150
o
C
At T
vj
= 150
o
C
Max.
1.53
30
1.10
1.30
Units
V
mA
V
mΩ
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MP02 XX 130 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 130 - 22
MP
02
HB
130
22
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at T
case
= 75
o
C
= V
RRM
/100
Examples:
MP02HB130 - 20
MP02G130 - 25
MP02GN130 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when
requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved.
Power dissipation may be calculated by use of V
TO
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to remove
oxide build up and foreign material. Care should be taken
to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the other. Such action may DAMAGE the
module.
3/9
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