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352210MJT

Description
3522 10M 5% 3W
CategoryPassive components    The resistor   
File Size336KB,4 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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3522 10M 5% 3W

352210MJT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTE Connectivity
package instructionSMT, 2512
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionTE Connectivity 3522 Series Thick Film Surface Mount Fixed Resistor 2512 Case 10MΩ ±5% 3W
structureRECTANGULAR PACKAGE
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height1.1 mm
Package length6.35 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.2 mm
method of packingTR, 7 INCH
Rated power dissipation(P)3 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance10000000 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage250 V
SMD POWER RESISTORS
Type 3522 Series
Key Features
3 Watts at
70°C
Small size to
power ratio
Supplied on
tape
Value marked
on resistor
Available via
distribution
500 volt
maximum
overload
250 volt
working
voltage
Terminal finish
matte Sn over
Ni
TE Connectivity is pleased to introduce this low cost high power device, suitable
for auto placement in volume and for most applications, including high
frequency operations, owing to the short lead structure. Supplied as standard
on 7 inch Reels of 2000 pieces per reel.
Characteristics – Electrical
Power rating at 70°C
Rated current (Jumper)
Max. overload current (Jumper)
Max working voltage
Max overload voltage
Dielectric withstand voltage
Temperature range
Ambient temperature
3W
2.5A
10A
250V
500V
500V
-55°C ~ +155°C
70°C
* Rated continuous working voltage (RCWV) shall be determined from
RCWV = Rated Power x Resistance Value, or Maximum RCWV listed above,
whichever is less
**Recommended Circuit Board Design - If this device is anticipated to run at full
continuous power then action to improve the cooling should be taken. This can
be a metal substrate, copper pad left under the chip, an opening in the PCB or
enlarged silver conductor pads each end.
9-1773463-7 CIS WR 10/2015
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
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