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EXB2HV330JV

Description
Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.25W, 33ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1506, CHIP
CategoryPassive components    The resistor   
File Size321KB,6 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance
Related ProductsFound4parts with similar functions to EXB2HV330JV
Download Datasheet Parametric View All

EXB2HV330JV Overview

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.25W, 33ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1506, CHIP

EXB2HV330JV Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionCHIP
Reach Compliance Codecompli
Other featuresSTANDARD: IEC60115-9
structureChi
Component power consumption0.063 W
The first element resistor33 Ω
JESD-609 codee3
Installation featuresSURFACE MOUNT
Network TypeISOLATED
Number of components1
Number of functions8
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length3.8 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTR, PUNCHED, 7 INCH
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance33 Ω
Resistor typeARRAY/NETWORK RESISTOR
size code1506
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage25 V
Base Number Matches1
Chip Resistor Array
Chip Resistor Array
Type:
EXB1 : 0201 Array
EXB2 : 0402 Array
EXB3 : 0603 Array
EXBN : 0402 Array
EXBV : 0603 Array
EXBS : 0805 Array
Features
High density
2 resistors in 0.8 mm
4 resistors in 1.4 mm
2 resistors in 1.0 mm
4 resistors in 2.0 mm
8 resistors in 3.8 mm
2 resistors in 1.6 mm
4 resistors in 3.2 mm
4 resistors in 5.1 mm
0.6 mm size
0.6 mm size
1.0 mm size
1.0 mm size
1.6 mm size
1.6 mm size
1.6 mm size
2.2 mm size
(EXB14V)
(EXB18V)
(EXB24V)
(EXB28V, N8V)
(EXB2HV)
(EXB34V, V4V)
(EXB38V, V8V)
(EXBS8V)
Improvement of placement efficiency
Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
B
V
8
V
4
7
2
J
V
Product Code
Thick Film
Chip Resistor
Networks
1
2
3
N
V
S
Chip Resistor Array
Type: inches
0201 Array
0402 Array
0603 Array
0402 Array
0603 Array
0805 Array
Convex
Terminal
Concave
Terminal
No. of Terminal
4 4 Terminal
8 8 Terminal
H 16 Terminal
Schematics
Packaging Methods
Resistance Value
Resistance
Packaging
Type
Isolated The first two digits are Tolerance Code
V
type
significant figures of
J
±5
%
Embossed Carrier Taping
EXBS8V
Nil 4 mm pitch
resistance value and
0 Jumper
the third one denotes
Punched Carrier Taping EXB14V, 18V,
the number of zeros
X 2 mm pitch
24V, 28V, N8V
following. Jumper is
Punched Carrier Taping EXB2HV, 34V,
expressed by R00
V 4 mm pitch
38V, V4V, V8V
Example: 222: 2.2 k
Construction (Example : Concave Terminal)
Schematics
Isolated type
14V, 24V, 34V, V4V
2 resistors
4
3
8
18V, 28V, N8V, 38V, V8V, S8V
4 resistors
7
6
5
Protective coating
1
2
1
2
3
4
Alumina substrate
Electrode (Outer)
Electrode (Between)
2HV
8 resistors
16 15 14 13 12 11 10
9
Thick film
resistive element
Electrode (Inner)
1
2
3
4
5
6
7
8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008

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