WBC-T0303AS-03-2671-F datasheet, PDF

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WBC-T0303AS-03-2671-F: DescriptionResistor Networks & Arrays; CategoryPassive components; File Size351KB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

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Resistor Networks & Arrays

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Manufacturer	TT Electronics plc
Product Category	Resistor Networks & Arrays

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Resistors

Wire Bondable

WBC Series

Chip Resistors

Wire Bondable

Chip Resistors

Discrete or tapped schematics

MIL inspection available

WBC Series

High resistor density

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)

IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.

The WBC combines IRC’s TaNSil

tantalum nitride thin ﬁlm technology with silicon substrate processing to

produce an extremely small tantalum nitride thin ﬁlm technology with silicon substrate processing to produce

an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor ﬁlm.

Available in a wide range of tolerances and temperature coefﬁcients to ﬁt a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

( 0 . 5 0 8 mm ± 0 . 0 2 5 )

0. 020˝ ± 0. 001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

(not to exceed

√

P x R )

Operating Temperature

Back contact

Noise

Top contact

pad chamfered

0.004˝ min bond pad size

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Al / Au optional)

3KÅ Au minimum

10KÅ Al minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

( 0 . 5 0 8 mm ± 0 . 0 2 5 )

0. 020˝ ± 0. 001

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

( 0 . 7 6 2 mm ± 0 . 0 2 5 )

0. 030˝ ± 0. 001

½R

Backside

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

Passivation

Note 1: Not recommended for new designs

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

BI Technologies IRC Welwyn

http://www.ttelectronics.com/resistors

WBC Series Issue January 2009 Sheet 1 of 3

05.17

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