CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For
θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -0.8V for all pins.
Analog Specifications
SYMBOL
R
TOTAL
Over recommended operating conditions, unless otherwise stated.
TEST CONDITIONS
W option
U option
MIN
(Note 22)
TYP
(Note 5)
10
50
-20
±50
±80
0
70
10/10/25
Voltage at pin from GND to V
CC
0.1
1
V
CC
200
+20
MAX
(Note 22)
UNIT
kΩ
kΩ
%
ppm/°C
(Note 21)
ppm/°C
(Note 21)
V
Ω
pF
µA
PARAMETER
R
H
to R
L
Resistance
R
H
to R
L
ResistanceTolerance
End-to-End Temperature Coefficient
W and U option
W option
U option
V
RH
, V
RL
R
W
C
H
/C
L
/C
W
(Note 21)
I
LkgDCP
V
RH
and V
RL
Terminal Voltages
Wiper Resistance
Potentiometer Capacitance
Leakage on DCP Pins
V
RH
and V
RL
to GND
V
CC
= 3.3V, wiper current = V
CC
/R
TOTAL
VOLTAGE DIVIDER MODE
(0V @ R
L
i; V
CC
@ R
H
i; measured at R
W
i, unloaded; i = 0, 1, 2 or 3)
INL
(Note 10)
DNL
(Note 9)
ZSerror
(Note 7)
Integral Non-linearity
Differential Non-linearity
Zero-scale Error
Monotonic over all tap positions, W and U
options
Monotonic over all tap positions, W and U
options
W option
U option
-1
-0.5
0
0
1
0.5
1
0.5
5
2
LSB
(Note 6)
LSB
(Note 6)
LSB
(Note 6)
LSB
(Note 6)
3
FN6181.2
September 9, 2009
ISL22446
Analog Specifications
SYMBOL
FSerror
(Note 8)
Over recommended operating conditions, unless otherwise stated.
(Continued)
TEST CONDITIONS
W option
U option
V
MATCH
(Note 11)
TC
V
(Note 12)
DCP to DCP Matching
Any two DCPs at same tap position, same
voltage at all R
H
terminals, and same voltage
at all R
L
terminals
DCP register set to 40 hex
MIN
(Note 22)
-5
-2
-2
TYP
(Note 5)
-1
-1
MAX
(Note 22)
0
0
2
UNIT
LSB
(Note 6)
LSB
(Note 6)
LSB
(Note 6)
ppm/°C
PARAMETER
Full-scale Error
Ratiometric Temperature Coefficient
±4
RESISTOR MODE
(Measurements between R
W
i and R
L
i with R
H
i not connected, or between R
W
i and R
H
i with R
L
i not connected; i = 0, 1, 2 or 3)
RINL
(Note 16)
RDNL
(Note 15)
Integral Non-linearity
Differential Non-linearity
DCP register set between 10h and 7Fh;
monotonic over all tap positions
DCP register set between 10h and 7Fh;
monotonic over all tap positions, W option
DCP register set between 10h and 7Fh;
monotonic over all tap positions, U option
Roffset
(Note 14)
Offset
W option
U option
R
MATCH
(Note 17)
DCP to DCP Matching
Any two DCPs at the same tap position with
the same terminal voltages
-1
-1
-0.5
0
0
-2
1
0.5
1
1
0.5
7
2
2
MI
(Note 13)
MI
(Note 13)
MI
(Note 13)
MI
(Note 13)
MI
(Note 13)
MI
(Note 13)
Operating Specifications
Over the recommended operating conditions, unless otherwise specified.
SYMBOL
I
CC1
I
CC2
I
SB
PARAMETER
V
CC
Supply Current (Volatile
Write/Read)
V
CC
Supply Current (Non-volatile
Write/Read)
V
CC
Current (Standby)
TEST CONDITIONS
f
SCK
= 5MHz; (for SPI Active, Read and
Volatile Write states only)
f
SCK
= 5MHz; (for SPI Active, Read and
Non-volatile Write states only)
V
CC
= +5.5V @ +85°C, SPI interface in
standby state
V
CC
= +5.5V @ +125°C, SPI interface in
standby state
V
CC
= +3.6V @ +85°C, SPI interface in
standby state
V
CC
= +3.6V @ +125°C, SPI interface in
standby state
I
SD
V
CC
Current (Shutdown)
V
CC
= +5.5V @ +85°C, SPI interface in
standby state
V
CC
= +5.5V @ +125°C, SPI interface in
standby state
V
CC
= +3.6V @ +85°C, SPI interface in
standby state
V
CC
= +3.6V @ +125°C, SPI interface in
standby state
MIN
(Note 22)
TYP
(Note 5)
MAX
(Note 22)
0.5
3
5
7
3
5
3
5
2
4
UNIT
mA
mA
µA
µA
µA
µA
µA
µA
µA
µA
4
FN6181.2
September 9, 2009
ISL22446
Operating Specifications
Over the recommended operating conditions, unless otherwise specified.
(Continued)
SYMBOL
I
LkgDig
t
WRT
(Note 21)
t
ShdnRec
(Note 21)
PARAMETER
TEST CONDITIONS
MIN
(Note 22)
-1
1.5
From rising edge of SHDN signal to wiper
stored position and RH connection
SCK rising edge of last bit of ACR data byte
to wiper stored position and RH connection
Vpor
VccRamp
t
D
Power-on Recall Voltage
V
CC
Ramp Rate
Power-up Delay
V
CC
above Vpor, to DCP Initial Value
Register recall completed, and SPI Interface
in standby state
Minimum V
CC
at which memory recall occurs
2.0
0.2
3
1.5
1.5
2.6
TYP
(Note 5)
MAX
(Note 22)
1
UNIT
µA
µs
µs
µs
V
V/ms
ms
Leakage Current at Pins SHDN, SCK, Voltage at pin from GND to V
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