LM4050/LM4051_E_ _ _ ................................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s)..................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS—1.225V
(I
R
= 100µA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Reverse Breakdown Voltage
SYMBOL
V
R
T
A
= +25°C
LM4051A
Reverse Breakdown Voltage
Tolerance (Note 2)
Minimum Operating Current
Average Reverse Voltage
Temperature Coefficient
(Notes 2, 3)
Reverse Breakdown Voltage
Change with Operating
Current Change
Reverse Dynamic
Impedance (Note 3)
Wideband Noise
Reverse Breakdown Voltage
Long-Term Stability
Z
R
e
N
∆V
R
V
RTOL
I
RMIN
∆V
R
/∆T
I
R
= 10mA
I
R
= 1mA
I
R
= 100µA
I
RMIN
≤
I
R
≤
1mA
1mA
≤
I
R
≤
12mA
I
R
= 1mA, f = 120Hz, I
AC
= 0.1I
R
I
R
= 100µA, 10Hz
≤
f
≤
10kHz
T = 1000h
LM4051B
LM4051C
CONDITIONS
LM4051A (0.1%)
LM4051B (0.2%)
LM4051C (0.5%)
MIN
1.2238
1.2226
1.2189
TYP
1.2250
1.2250
1.2250
±1.2
±2.4
±6.0
45
±20
±15
±15
0.7
2.5
0.5
20
120
1.5
mV
8.0
1.5
Ω
µV
RMS
ppm
MAX
1.2262
1.2275
1.2311
±7
±9
±12
60
±50
µA
ppm/°C
mV
V
UNITS
2
Maxim Integrated
LM4050/LM4051
50ppm/°C Precision Micropower Shunt Voltage
References with Multiple Reverse Breakdown Voltages
ELECTRICAL CHARACTERISTICS—2.048V
(I
R
= 100µA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Reverse Breakdown Voltage
SYMBOL
V
R
T
A
= +25°C
LM4050A
Reverse Breakdown Voltage
Tolerance (Note 2)
Minimum Operating Current
Average Reverse Voltage
Temperature Coefficient
(Notes 2, 3)
Reverse Breakdown Voltage
Change with Operating
Current Change
Reverse Dynamic
Impedance (Note 3)
Wideband Noise
Reverse Breakdown Voltage
Long-Term Stability
Z
R
e
N
∆V
R
V
RTOL
I
RMIN
∆V
R
/∆T
I
R
= 10mA
I
R
= 1mA
I
R
= 100µA
I
RMIN
≤
I
R
≤
1mA
1mA
≤
I
R
≤
15mA
I
R
= 1mA, f = 120Hz,
I
AC
= 0.1I
R
LM4050A/B
LM4050C
LM4050B
LM4050C
CONDITIONS
LM4050A (0.1%)
LM4050B (0.2%)
LM4050C (0.5%)
MIN
2.0460
2.0439
2.0378
TYP
2.0480
2.0480
2.0480
±2.0
±4.0
±10
45
±20
±15
±15
0.3
2.5
0.3
0.3
28
120
1.0
mV
8.0
0.8
0.9
Ω
µV
RMS
ppm
MAX
2.0500
2.0521
2.0582
±12
±14
±20
65
±50
µA
ppm/°C
mV
V
UNITS
I
R
= 100µA, 10Hz
≤
f
≤
10kHz
T = 1000h
Maxim Integrated
3
LM4050/LM4051
50ppm/°C Precision Micropower Shunt Voltage
References with Multiple Reverse Breakdown Voltages
ELECTRICAL CHARACTERISTICS—2.500V
(I
R
= 100µA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Reverse Breakdown Voltage
SYMBOL
V
R
T
A
= +25°C
LM4050A
Reverse Breakdown Voltage
Tolerance (Note 2)
Minimum Operating Current
Average Reverse Voltage
Temperature Coefficient
(Notes 2, 3)
Reverse Breakdown Voltage
Change with Operating
Current Change
Reverse Dynamic
Impedance (Note 3)
Wideband Noise
Reverse Breakdown Voltage
Long-Term Stability
Z
R
e
N
∆V
R
V
RTOL
I
RMIN
I
R
= 10mA
∆V
R
/∆T
I
R
= 1mA
I
R
= 100µA
I
RMIN
≤
I
R
≤
1mA
1mA
≤
I
R
≤
15mA
I
R
= 1mA, f = 120Hz,
I
AC
= 0.1I
R
LM4050A/B
LM4050C
LM4050B
LM4050C
CONDITIONS
LM4050A (0.1%)
LM4050B (0.2%)
LM4050C (0.5%)
MIN
2.4975
2.4950
2.4875
TYP
2.5000
2.5000
2.5000
±2.5
±5.0
±13
45
±20
±15
±15
0.3
2.5
0.3
0.3
35
120
1.0
mV
8.0
0.8
0.9
Ω
µV
RMS
ppm
±50
ppm/°C
MAX
2.5025
2.5050
2.5125
±15
±18
±25
65
µA
mV
V
UNITS
I
R
= 100µA, 10Hz
≤
f
≤
10kHz
T = 1000h
4
Maxim Integrated
LM4050/LM4051
50ppm/°C Precision Micropower Shunt Voltage
References with Multiple Reverse Breakdown Voltages
Upload a CRC code generation program written in VB; The source code is as follows: 'CRC校验码生成Private Function CrcResult(ByVal Data As Long, ByVal Genpoly As Long, ByVal CrcData As Long) As LongDim n As...
I would like to ask the experts, why is it that the LC filters made with the same batch of capacitors can all meet the standing wave requirements, but the insertion loss is very different, one is 2 cl...
The area where video surveillance needs to be installed is on a mountain. The equipment currently in use is a four-channel hard disk recorder from Yunshitong. There are three cameras. Since the video ...
As shown in the figure above, the infrared receiving tube should be connected in the correct way according to the left picture. At that time, during the debugging project, it was found that the effect...
To thank the forum for providing the group purchase opportunity of the development board again, I have sorted out the relevant information, all of which are transferred from the Internet, so that you ...
New energy pure electric vehicles generally accelerate faster than comparable fuel-powered vehicles, both from a standing start and while accelerating. Many believe this is simply due to the motor'...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
introduction
According to the China Fire Statistics Yearbook, electrical fires accounted for more than 30% of fire accidents in the past decade, and the trend is increasing year by year. They ...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
Introduction: In digital circuit calculations, there is no concept of decimal points. You know where the decimal is, but the circuit does not know where the decimal point is. Therefore, you need to...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
Smartphones can be incredibly unintelligent. For example, consider an office full of people, each absorbed in their work. Suddenly, the silence is broken by a burst of loud pop music. A colleague's...[Details]
High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]
Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]