BAS40/ -04/ -05/ -06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Product Summary
@T
A
= +25°C
V
RRM
(V)
40
I
O
(mA)
200
V
Fmax
(V)
1.0
I
Rmax
(μA)
0.2
Features and Benefits
Low Forward Voltage Drop
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description
200mA surface mount Schottky Barrier Diode in SOT23 package,
offers low forward voltage drop and fast switching capability, designed
with PN Junction Guard Ring for Transient and ESD Protection, totally
lead-free finish and RoHS compliant, ”Green” device.
Mechanical Data
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
e3
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagrams Below
Weight: 0.008 grams (approximate)
Top View
BAS40
BAS40-04
BAS40-05
BAS40-06
Ordering Information
(Note 4 & 5)
Part Number
BAS40-7-F
BAS40-04-7-F
BAS40-05-7-F
BAS40-06-7-F
Notes:
Case
SOT23
SOT23
SOT23
SOT23
Packaging
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
5. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BAS40/ -04/ -05/ -06
Document number: DS11006
Rev. 24 - 2
1 of 5
www.diodes.com
October 2013
© Diodes Incorporated
BAS40/ -04/ -05/ -06
Marking Information
xxx = Product Type Marking Code
K43 = BAS40
K44 = BAS40-04
K45 = BAS40-05
K46 = BAS40-06
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
̅
Y or Y = Year (ex: A = 2013)
̅
M = Month (ex: 9 = September)
Shanghai A/T Site
Date Code Key
Year
1999
Code
K
Month
Code
Jan
1
Chengdu A/T Site
2000
L
2001
M
Feb
2
2002
N
Mar
3
2003
P
2004
R
2005
S
May
5
2006
T
Jun
6
2007
U
2008
V
Jul
7
2009
W
Aug
8
2010
X
2011
Y
2012
Z
Oct
O
2013
A
Nov
N
2014
B
2015
C
Dec
D
Apr
4
Sep
9
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 6)
Forward Surge Current (Note 6)
@ t < 1.0s
Symbol
V
RRM
V
RWM
V
R
I
FM
I
FSM
Value
40
200
600
Unit
V
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient Air (Note 6)
Operating Temperature Range
Storage Temperature Range
Symbol
P
D
R
JA
T
J
T
STG
Value
350
357
-55 to +125
-65 to +150
Unit
mW
°C/W
°C
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Reverse Breakdown Voltage (Note 7)
Forward Voltage
Reverse Leakage Current (Note 7)
Total Capacitance
Reverse Recovery Time
Notes:
Symbol
V
(BR)R
V
F
I
R
C
T
t
rr
Min
40
Typ
20
4.0
Max
380
1000
200
5.0
5.0
Unit
V
mV
nA
pF
ns
I
R
= 10µA
Test Condition
t
p
< 300µs, I
F
= 1.0mA
t
p
< 300µs, I
F
= 40mA
t
p
< 300µs, V
R
= 30V
V
R
= 0V, f =1.0MHz
I
F
= I
R
= 10mA to I
R
= 1.0mA,
R
L
= 100Ω
6. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
7. Short duration pulse test used to minimize self-heating effect.
BAS40/ -04/ -05/ -06
Document number: DS11006
Rev. 24 - 2
2 of 5
www.diodes.com
October 2013
© Diodes Incorporated
BAS40/ -04/ -05/ -06
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
400
P
D
, POWER DISSIPATION (mW)
1
300
0.1
200
0.01
100
0.001
0
0.0001
0
160
200
40
80
120
T
A
, AMBIENT TEMPERATURE (ºC)
Figure 1 Power Derating Curve, Total Package
0.2
0.4
0.6
0
0.8
1.0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2 Typical Forward Characteristics
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
10,000
3
C
T
, TOTAL CAPACITANCE (pF)
1,000
100
2
10
1
1
0.1
0
10
20
30
40
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3 Typical Reverse Characteristics
0
0
10
30
40
20
V
R
, DC REVERSE VOLTAGE (V)
Figure 4 Total Capacitance vs. Reverse Voltage
BAS40/ -04/ -05/ -06
Document number: DS11006
Rev. 24 - 2
3 of 5
www.diodes.com
October 2013
© Diodes Incorporated
BAS40/ -04/ -05/ -06
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A ll 7 °
H
J
K
G A U G E P L A N E
0 . 2 5
K 1
a
A
M
L
L 1
C
B
D
F
G
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
8°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
C
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
2.0
C
1.35
E
X
E
BAS40/ -04/ -05/ -06
Document number: DS11006
Rev. 24 - 2
4 of 5
www.diodes.com
October 2013
© Diodes Incorporated
BAS40/ -04/ -05/ -06
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
BAS40/ -04/ -05/ -06
Document number: DS11006
Rev. 24 - 2
5 of 5
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October 2013
© Diodes Incorporated
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