MC34903CS3EKR2 datasheet, PDF - EEWORLD Datasheet

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MC34903CS3EKR2: DescriptionPower Management Specialized - PMIC 3.3V REG CAN Hi Spd & LIN IF; CategoryWireless rf/communication Telecom circuit; File Size1MB，94 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC34903CS3EKR2 Overview

Power Management Specialized - PMIC 3.3V REG CAN Hi Spd & LIN IF

MC34903CS3EKR2 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
package instruction	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
length	11 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	2.45 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	SUPPORT CIRCUIT
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	7.5 mm
Base Number Matches	1

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Freescale Semiconductor

Technical Data

Document Number: MC34903_4_5

Rev. 4.0, 10/2013

System Basis Chip with CAN

High Speed and LIN Interface

The 34903/4/5 is the second generation family of the System Basis

Chip (SBC). It combines several features and enhances present

module designs. The device works as an advanced power

management unit for the MCU with additional integrated circuits such

as sensors and CAN transceivers. It has a built-in enhanced high-speed

CAN interface (ISO11898-2 and -5) with local and bus failure

diagnostics, protection, and fail-safe operation modes. The SBC may

include zero or one LIN 2.1 interface with LIN output pin switches. It

includes up to four wake-up input pins that can also be configured as

output drivers for flexibility. This device is powered by SMARTMOS

technology.

This device implements multiple Low-power (LP) modes, with very

low-current consumption. In addition, the device is part of a family

concept where pin compatibility adds versatility to module design.

The 34903/4/5 also implements an innovative and advanced fail-safe

state machine and concept solution.

Features

• Voltage regulator for MCU, 5.0 or 3.3 V, part number selectable, with

possibility of usage external PNP to extend current capability and

share power dissipation

• Voltage, current, and temperature protection

• Extremely low quiescent current in LP modes

• Fully-protected embedded 5.0 V regulator for the CAN driver

• Multiple undervoltage detections to address various MCU

specifications and system operation modes (i.e. cranking)

• Auxiliary 5.0 or 3.3 V SPI configurable regulator, for additional ICs,

with overcurrent detection and undervoltage protection

• MUX output pin for device internal analog signal monitoring and

power supply monitoring

• Advanced SPI, MCU, ECU power supply, and critical pins

diagnostics and monitoring.

• Multiple wake-up sources in LP modes: CAN or LIN bus,

I/O transition, automatic timer, SPI message, and V

overcurrent

detection.

• ISO11898-5 high-speed CAN interface compatibility for baud rates of

40 kb/s to 1.0 Mb/s

• Scalable product family of devices ranging from 0 to 1 LIN,

compatible to J2602-2 and LIN 2.1

34903/4/5

34903/

Industrial

SYSTEM BASIS CHIP

EK Suffix (Pb-free)

98ASA10556D

32-PIN SOIC

•

Applications

Industrial process control

Automation

Motor control

Robotics

Freescale Semiconductor, Inc. reserves the right to change the detail specifications,

as may be required, to permit improvements in the design of its products.

TABLE OF CONTENTS

Simplified Application Diagrams ................................................................................................................. 3

Device Variations ....................................................................................................................................... 5

Internal Block Diagrams ............................................................................................................................. 6

Pin Connections ......................................................................................................................................... 8

Electrical Characteristics .......................................................................................................................... 12

Maximum Ratings .................................................................................................................................. 12

Static Electrical Characteristics ............................................................................................................. 15

Dynamic Electrical Characteristics ........................................................................................................ 23

Timing Diagrams ................................................................................................................................... 26

Functional Description .............................................................................................................................. 31

Introduction ............................................................................................................................................ 31

Functional Pin Description ..................................................................................................................... 31

Functional Device Operation .................................................................................................................... 35

Mode and State Description .................................................................................................................. 35

LP Modes .............................................................................................................................................. 36

State Diagram ........................................................................................................................................ 37

Mode Change ........................................................................................................................................ 38

Watchdog Operation .............................................................................................................................. 38

Functional Block Operation Versus Mode ............................................................................................. 40

Illustration of Device Mode Transitions. ................................................................................................. 41

Cyclic Sense Operation During LP Modes ............................................................................................ 43

Behavior at Power Up and Power Down ............................................................................................... 45

Fail-safe Operation ................................................................................................................................... 47

CAN Interface ........................................................................................................................................ 51

CAN Interface Description ..................................................................................................................... 51

CAN Bus Fault Diagnostic ..................................................................................................................... 54

LIN Block .................................................................................................................................................. 57

LIN Interface Description ....................................................................................................................... 57

LIN Operational Modes .......................................................................................................................... 57

Serial Peripheral Interface ........................................................................................................................ 59

High Level Overview .............................................................................................................................. 59

Detail Operation ..................................................................................................................................... 60

Detail of Control Bits And Register Mapping ......................................................................................... 63

Flags and Device Status ........................................................................................................................ 78

Typical Applications ................................................................................................................................. 85

Packaging ................................................................................................................................................ 90

34903/4/5

Analog Integrated Circuit Device Data

Freescale Semiconductor

MC34903CS3EKR2 Related Products

	MC34903CS3EKR2	MC34903CP3EK	MC34903CP3EKR2	MC34905CS5EK	MC34905CS3EKR2	MC34904C3EK	MC34905CS3EK	MC34903CP5EKR2	MC34903CS5EKR2
Description	Power Management Specialized - PMIC 3.3V REG CAN Hi Spd & LIN IF	Power Management Specialized - PMIC 3.3V REG+CAN+0 LIN	Power Management Specialized - PMIC 3.3V REG,CAN, 0 LIN	Power Management Specialized - PMIC 5V REG + CAN Hi Spd & LIN IF	Power Management Specialized - PMIC 3.3V REG CAN Hi Spd & LIN IF	Power Management Specialized - PMIC 3.3V REG + CAN	Power Management Specialized - PMIC 3.3V REG CAN Hi Spd & LIN IF	Power Management Specialized - PMIC SBC W/HIGH SPEED CAN 5V	Power Management Specialized - PMIC 5V REG + CAN Hi Spd & LIN IF
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	-	NXP	NXP	NXP	NXP
package instruction	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	-	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32	0.65 MM PITCH, ROHS COMPLIANT, SOIC-32
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	-	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e3	e3	e3	e3	-	e3	e3	e3	e3
length	11 mm	11 mm	11 mm	11 mm	-	11 mm	11 mm	11 mm	11 mm
Humidity sensitivity level	3	3	3	3	-	3	3	3	3
Number of functions	1	1	1	1	-	1	1	1	1
Number of terminals	32	32	32	32	-	32	32	32	32
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HSSOP	HSSOP	HSSOP	HSSOP	-	HSSOP	HSSOP	HSSOP	HSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	-	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	260	260	260
Maximum seat height	2.45 mm	2.45 mm	2.45 mm	2.45 mm	-	2.45 mm	2.45 mm	2.45 mm	2.45 mm
Nominal supply voltage	3.3 V	3.3 V	3.3 V	5 V	-	3.3 V	3.3 V	5 V	5 V
surface mount	YES	YES	YES	YES	-	YES	YES	YES	YES
Telecom integrated circuit types	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	-	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	40	40	-	40	40	40	40
width	7.5 mm	7.5 mm	7.5 mm	7.5 mm	-	7.5 mm	7.5 mm	7.5 mm	7.5 mm
Base Number Matches	1	1	1	1	-	1	1	1	1
Brand Name	-	Freescale	Freescale	-	-	Freescale	Freescale	Freescale	Freescale

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