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74LVC1G07GV

Description
LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5
Categorylogic    logic   
File Size76KB,15 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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74LVC1G07GV Overview

LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5

74LVC1G07GV Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSOP, TSOP5/6,.11,37
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G5
JESD-609 codee3
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of terminals5
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Encapsulate equivalent codeTSOP5/6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
method of packingTAPE AND REEL
power supply3.3 V
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74LVC1G07
Buffer with open-drain output
Product specification
Supersedes data of 2003 Mar 07
2004 Sep 07

74LVC1G07GV Related Products

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Description LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5 LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5 8-Bit Addressable Latches 16-SOIC -40 to 85 LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5
Is it Rohs certified? conform to incompatible - conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSOP, TSOP5/6,.11,37 SON, SOLCC6,.04,20 - TSSOP, TSSOP5/6,.08
Reach Compliance Code unknow unknow - unknow
JESD-30 code R-PDSO-G5 R-PDSO-N6 - R-PDSO-G5
JESD-609 code e3 e0 - e3
Logic integrated circuit type BUFFER BUFFER - BUFFER
MaximumI(ol) 0.024 A 0.024 A - 0.024 A
Number of terminals 5 6 - 5
Maximum operating temperature 125 °C 125 °C - 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN - OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSOP SON - TSSOP
Encapsulate equivalent code TSOP5/6,.11,37 SOLCC6,.04,20 - TSSOP5/6,.08
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL - TR
power supply 3.3 V 3.3 V - 3.3 V
Certification status Not Qualified Not Qualified - Not Qualified
Schmitt trigger NO NO - NO
Nominal supply voltage (Vsup) 3.3 V 3.3 V - 3.3 V
surface mount YES YES - YES
technology CMOS CMOS - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
Terminal surface Matte Tin (Sn) Tin/Lead (Sn/Pb) - Matte Tin (Sn)
Terminal form GULL WING NO LEAD - GULL WING
Terminal pitch 0.95 mm 0.5 mm - 0.635 mm
Terminal location DUAL DUAL - DUAL
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