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GS72116ATP-10I

Description
Standard SRAM, 128KX16, 10ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
Categorystorage    storage   
File Size494KB,14 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Download Datasheet Parametric View All

GS72116ATP-10I Overview

Standard SRAM, 128KX16, 10ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44

GS72116ATP-10I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP2
package instructionTSOP2,
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time10 ns
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.41 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Base Number Matches1
GS72116ATP/U
TSOP, FP-BGA
Commercial Temp
Industrial Temp
Features
• Fast access time: 7, 8, 10, 12 ns
• CMOS low power operation: 145/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option:
–40°
to 85°C
• Package line up
TP: 400 mil, 44-pin TSOP Type II package
GP: RoHS-compliant 400 mil, 44-pin TSOP Type II
package
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball Grid
Array package
128K x 16
2Mb Asynchronous SRAM
1
2
3
4
7, 8, 10, 12 ns
3.3 V V
DD
Center V
DD
and V
SS
Fine Pitch BGA 128K x 16-Bump Configuration
5
6
A
B
C
D
E
F
G
H
LB
DQ
16
OE
UB
A
0
A
3
A
5
NC
NC
A
8
A
10
A
13
A
1
A
4
A
6
A
7
A
16
A
9
A
11
A
14
A
2
CE
DQ
2
DQ
4
DQ
5
DQ
7
WE
A
15
NC
DQ
1
DQ
3
V
DD
V
SS
DQ
14
DQ
15
V
SS
V
DD
DQ
13
DQ
12
DQ
11
DQ
10
DQ
9
NC
NC
A
12
DQ
6
DQ
8
NC
Description
The GS72116A is a high speed CMOS Static RAM organized
as 131,072 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a
single 3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS72116A is available in a 6 mm x 8 mm
Fine Pitch BGA and 400 mil TSOP Type-II packages.
6 mm x 8 mm, 0.75 mm Bump Pitch
Top View
Package U
TSOP-II 128K x 16-Pin Configuration
A
4
A
3
A
2
A
1
A
0
CE
DQ
1
DQ
2
DQ
3
DQ
4
V
DD
V
SS
DQ
5
DQ
6
DQ
7
DQ
8
WE
A
15
A14
A
13
A
12
A
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
UB
LB
DQ
16
DQ
15
DQ
14
DQ
13
V
SS
V
DD
DQ
12
DQ
11
DQ
10
DQ
9
NC
A
8
A
9
A
10
A
11
NC
Pin Descriptions
Symbol
A
0
–A
16
DQ
1
–DQ
16
CE
LB
UB
WE
OE
V
DD
V
SS
NC
Description
Address input
Data input/output
Chip enable input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Write enable input
Output enable input
+3.3 V power supply
Ground
No connect
Top view
44-pin
TSOP II
Package TP
Rev: 1.10 3/2010
1/14
© 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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