EPROM MOUNTED-TYPE MICRO-COMPUTER WHICH UTILZES CMOS TECHNOLOGY
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Mitsubishi |
| package instruction | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknow |
| bit size | 8 |
| CPU series | MELPS740 |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -10 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP64,.75 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 160 |
| rom(word) | 10240 |
| ROM programmability | MROM |
| speed | 1 MHz |
| Maximum slew rate | 6 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| M50963-XXXSP | M50964-PGYS | M50964-XXXSP | |
|---|---|---|---|
| Description | EPROM MOUNTED-TYPE MICRO-COMPUTER WHICH UTILZES CMOS TECHNOLOGY | EPROM MOUNTED-TYPE MICRO-COMPUTER WHICH UTILZES CMOS TECHNOLOGY | EPROM MOUNTED-TYPE MICRO-COMPUTER WHICH UTILZES CMOS TECHNOLOGY |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Mitsubishi | Mitsubishi | Mitsubishi |
| package instruction | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknow | unknow | unknow |
| bit size | 8 | 8 | 8 |
| CPU series | MELPS740 | MELPS740 | MELPS740 |
| JESD-30 code | R-PDIP-T64 | R-XDIP-T64 | R-PDIP-T64 |
| JESD-609 code | e0 | e0 | e0 |
| Number of terminals | 64 | 64 | 64 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -10 °C | -10 °C | -10 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP | SDIP |
| Encapsulate equivalent code | SDIP64,.75 | SDIP64,.75 | SDIP64,.75 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 160 | 160 | 160 |
| rom(word) | 10240 | 16384 | 6144 |
| ROM programmability | MROM | EPROM | MROM |
| speed | 1 MHz | 1 MHz | 1 MHz |
| Maximum slew rate | 6 mA | 6 mA | 6 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.78 mm | 1.78 mm | 1.78 mm |
| Terminal location | DUAL | DUAL | DUAL |
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