BCC
Bump Chip Carrier
BCC+ (exposed paddle without ground ring)
• Saw singulated format
• Package height 0.8mm max.
• Square body size (rectangular body designable)
• Staggered dual row or single row bump design
BCC++ (exposed paddle with ground ring)
BCCs++ (staggered dual row design)
FEATURES
• Body sizes: 4 x 4mm to 9 x 9mm
• Lead pitch: 0.50mm and 0.80mm
• Custom body / lead / pitch configurations available
• Package profile heights (overall): maximum 0.80mm
• Both single row & dual row design
• Ni / Pd / Au plated bumps
• Excellent thermal and electrical performance
• Full in-house package and leadframe design capability
• Full in-house electrical, thermal and mechanical
simulation and measurement capability
• JEDEC standard compliant
DESCRIPTION
STATS ChipPAC’s Bump Chip Carrier (BCC) technology pro-
duces a chip scale leadframe based molded package with
bumps which are formed after the leadframe is etched away.
An exposed die pad coupled with extremely low RLC provides
excellent electrical and thermal performance enhancements
which are ideal for high frequency and high power applica-
tions especially for handheld portable applications such as
cell phones. The BCC is manufactured in a molded array
format that maximizes product throughput and material
utilization. The BCC is available with single row and dual row
bumps in BCC++ and BCC+. Overall package profile height is
0.80mm maximum.
APPLICATIONS
• RF
• Power Management
• Analog/Linear
• Logic
• Applications requiring enhanced electrical and thermal
performance and reduced package size and weight
www.statschippac.com
BCC
Bump Chip Carrier
SPECIFICATIONS
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
279µm nominal, 355µm max.
25µm (1.0mils) diameter
Preplated Ni/Pd/Au bumps
Laser
Tape & reel / JEDEC tray
RELIABILITY
Moisture Sensitivity Level
Temperature Cycling
High Temp Storage
Temp / Humidity Test
Pressure Cooker Test
JEDEC Level 2a/2/1@260°C
(depending upon package)
-65°C/150°C, 1000 cycles
150°C, 1000 hrs
85°C/85% RH, 1000 cycles
121°C, 100% RH, 2 atm,
168 hrs
PACKAGE CONFIGURATIONS
Package Size
(mm)
4
5
6
7
8
9
x
x
x
x
x
x
4
5
6
7
8
9
Lead Pitch
(mm)
0.80
0.50
0.50
0.50
0.50
0.50
Lead Count
16
32
40
48 / 84
56
11 6
CROSS-SECTIONS
BCC+
BCCs+
BCC++
BCCs++
Corporate Office
Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
JAPAN 81-3-5789-5850
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565
CHINA 86-21-5976-5858
UK 44-1483-413-700
MALAYSIA 603-4257-6222
NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.
May 2006
京公网安备 11010802033920号
EEWORLD
