EMIF02-1003M6
2 line IPAD™, EMI filter and ESD protection in Micro QFN package
Features
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Dual line EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consumption:
1.0 mm x 1.45 mm
Very thin package: 0.6 mm max
High efficiency in ESD suppression
(IEC 61000-4-2 level 4).
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging.
Lead free package
Easy layout and flexibility due to single line
topology
Low capacitance
Micro QFN 1.45 mm x 1.00 mm
(bottom view)
Figure 1.
Pin configuration (top view)
IN
1
6
OUT
Complies with following standards
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IEC 61000-4-2 level 4, input and output pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3B (all
pins)
GND
IN
2
5
GND
OUT
3
4
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Applications
Where EMI filtering in ESD sensitive equipment is
required:
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Figure 2.
Basic cell configuration
Keyboard for mobile phones
Computers and printers
Communication systems
MCU Boards
Input
R = 100
Ω
C
LINE
= 30 pF typ. @ 0 V
Output
Description
The EMIF02-1003M6 is a 2 line highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on all pins.
TM: IPAD is a trademark of STMicroelectronics
October 2007
Rev 1
1/10
www.st.com
Characteristics
EMIF02-1003M6
1
Table 1.
Symbol
V
PP
T
j
T
op
T
stg
Characteristics
Absolute ratings (limiting values at T
amb
= 25 °C unless otherwise specified)
Parameter
ESD discharge IEC61000-4-2 air discharge on input and output pins
ESD discharge IEC61000-4-2 contact discharge on input and output pins
Junction temperature
Operating temperature range
Storage temperature range
Value
15
8
125
-40 to + 85
-55 to +150
Unit
kV
°C
°C
°C
Table 2.
Symbol
V
BR
I
RM
V
RM
V
CL
R
d
I
PP
R
I/O
C
line
Symbol
V
BR
I
RM
R
I/O
C
line
S21
Electrical characteristics (T
amb
= 25 °C)
Parameter
I
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
Dynamic resistance
Peak pulse current
Series resistance between Input & Output
Input capacitance per line
Test conditions
I
R
= 1 mA
V
RM
= 3 V per line
Tolerance ± 10%
V
R
= 0 V
DC
, V
OSC
= 30 mV, F = 1 MHz
F = 900 MHz
100
30
Min.
5
Typ.
6.5
V
BR
V
CL
V
RM
I
F
V
F
I
RM
I
R
V
I
PP
Max.
8
100
39
-26
Unit
V
nA
Ω
pF
dB
2/10
EMIF02-1003M6
Characteristics
Figure 3.
dB
S21(db) attenuation measurement
(V
bias
= 0 V)
Figure 4.
Analog cross talk measurements
dB
0.00
0.00
-15.00
-5.00
-30.00
-10.00
-45.00
-15.00
-60.00
-75.00
-20.00
-90.00
-25.00
-105.00
F (Hz)
-30.00
100.0k
1.0M
I1-O1
10.0M
100.0M
I2-O2
1.0G
-120.00
100.0k
1.0M
I1-O2
10.0M
F (Hz)
100.0M
I2-O1
1.0G
Figure 5.
ESD response to IEC 61000-4-2
Figure 6.
(+15 kV air discharge) on one input
and on one output
ESD response to IEC 61000-4-2
(- 15 kV air discharge) on one input
and on one output
Input
Input
Output
Output
Figure 7.
Line capacitance versus reverse
voltage applied (typical value)
35
30
25
20
15
10
5
0
0
C
LINE
(pF)
V
LINE
(V)
1
2
3
4
5
3/10
Application schematic
EMIF02-1003M6
2
Application schematic
Figure 8.
Application schematic
1) Data lines protection
IN
1
6
OUT
Dat1
IC to Protect
GND
2
IN
3
5
GND
OUT
4
Dat2
2) Keypad protection
IN
1
6
OUT
Keypad
GND
2
5
GND
OUT
Controller
IN
3
4
Keypad
Keypad
3
Ordering information scheme
Figure 9.
Ordering information scheme
EMIF
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
Package
Mx = Micro QFN x leads
yy
-
xxx z
Mx
4/10
EMIF02-1003M6
Package information
4
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 3.
Micro QFN 1.45 x 1.00 6L dimensions
D
N
Dimensions
Ref.
E
Millimeters
Min.
Typ.
0.55
0.02
0.25
1.45
1.00
0.50
0.20
0.30
0.35
0.40
0.008
Max.
0.60
0.05
0.30
Min.
Inches
Typ.
Max.
1
2
A
A1
0.50
0.00
0.18
0.020 0.022 0.024
0.000 0.001 0.002
0.007 0.010 0.012
0.057
0.039
0.020
A
A1
1
2
b
D
L
k
b
e
E
e
K
L
0.012 0.014 0.016
Figure 10. Footprint in mm [inches]
0.50
[0.020]
0.25
[0.010]
Figure 11. Marking
Dot : Pi n 1 Identification
XX = Marking
0.60
[0.023]
0.30
1.60
[0.012] [0.063]
F
5/10
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