D at a S he et , V 2. 0 , N ov e m be r 2 00 9
B G F 10 4C
H S M MC I n t e rf a c e Fi l t e r a n d ESD P ro t e c t i o n
R F & P ro t e c ti o n D e v i c e s
Edition 2009-11-12
Published by
Infineon Technologies AG
81726 München, Germany
©
Infineon Technologies AG 2009.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BGF104C
HSMMC Interface Filter and ESD Protection
BGF104C
Revision History: 2009-11-12, V2.0
Previous Version: 2009-09-14, V1.0
Page
4
5
6
6
all
Subjects (major changes since last revision)
3D-figure of package updated
Figure 2
updated
Footprint (Figure
3)
added
Tape specification (Figure
4)
added
Target status removed
Data Sheet
3
V2.0, 2009-11-12
BGF104C
HSMMC Interface Filter and ESD Protection
BGF104C
BGF104C
Features
• ESD protection and filter for High Speed Multi Media Card interface
• ESD protection according to IEC61000-4-2 for
±15
kV contact discharge on
external IOs
• 16 pin green wafer level package with SnAgCu solder balls
• RoHS and WEEE compliant package
• 500
µm
solder ball pitch
• 300
µm
solder ball diameter
WLP-16-3-N
Description
BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. External pins are
protected against ESD pulses of
±15
kV contact discharge according to IEC61000-4-2. The wafer level package
is a green leadfree package with a size of only 1.92 mm x 1.92 mm and a total height of 0.65 mm.
R10, 75kΩ
R11, 75kΩ
R12, 75kΩ
R13, 75kΩ
Int. IOs
V
MMC
R14, 7kΩ
Ext. IOs
V
dd
R2, 50Ω
R3, 50Ω
R4, 50Ω
R5, 50Ω
R6, 50Ω
R7, 50Ω
clk
cmd
dat 0
dat 1
dat 2
dat 3
A3
A2
A1
B2
B1
C1
D1
A4
B4
C4
C3
D4
D3
MMCclk
MMCcmd
MMCdat0
MMCdat1
MMCdat2
MMCdat3
B3, C2, D2
GND
BGF104_ schematic.vsd
Figure 1
Type
BGF104C
Schematic
Package
WLP-16-3
Marking
4C
Chip
N0708
Data Sheet
4
V2.0, 2009-11-12
BGF104C
HSMMC Interface Filter and ESD Protection
BGF104C
Table 1
Parameter
Maximum Ratings
Symbol
Min.
Values
Typ.
–
–
–
–
–
Max.
14
+85
+150
15
2
V
°C
°C
kV
kV
0
-40
-65
-15
-2
Unit
Note /
Test Condition
–
–
–
–
–
Voltage at all pins to GND
Operating temperature range
Storage temperature range
Contact discharge external pins to GND
(A1, A2, A3, B1, B2, C1, D1)
Contact discharge internal pins to GND
(A4, B4,C3, C4, D3, D4)
Table 2
Parameter
Resistors
R
2
... R
7
Resistors
R
10
... R
13
Resistor
R
14
Line capacitance, each line to GND
2)
Reverse current of ESD protection diodes
I
R
= 3 V
I
R
= 14 V
1) at
T
A
= 25
°C
2) Without line coupling by Resistors
R
7
- R
11
Package Outlines
Electrical Characteristics
1)
V
P
T
OP
T
STG
V
ESD
V
ESD
Electrostatic Discharge According to IEC61000-4-2
Symbol
Min.
Values
Typ.
50
75
7
16
5
0.1
Max.
60
97.5
9.1
20
100
10
40
52.5
4.9
–
–
Unit
Ω
kΩ
kΩ
pF
nΑ
µA
Note /
Test Condition
–
–
–
R
2...7
R
10...13
R
14
C
T
I
R
V
=0V
–
0.65
±0.05
0.25
±0.05
STANDOFF
0.1 C
(0.21
±0.05
)
1.92
±0.05
3 x 0.5 = 1.5
0.5
D4
D3
D2
D1
B
(0.21
±0.05
)
A
SEATING PLANE
3)
3 x 0.5 = 1.5
B4
B3
B2
B1
A4
A3
A2
A1
C
0.5
Pin 1
Corner Index Area
2)
0.08 C
16x
COPLANARITY
0.5
0.3
±0.05 1)
16x
ø0.05
M
A B
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
WLP-16-3-N-PO V01
Figure 2
WLP-16-3
(dimensions in mm)
Data Sheet
5
(0.21
±0.05
)
V2.0, 2009-11-12
1.92
±0.05
C4
C3
C2
C1
(0.21
±0.05
)
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