CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Reach Compliance Code | unknown |
| Converter type | A/D CONVERTER |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Number of digits | 10 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output bit code | OFFSET BINARY |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| AD7571JN | AD7571 | AD7571AQ | AD7571SD | AD7571TD | AD7571BQ | AD7571KN | |
|---|---|---|---|---|---|---|---|
| Description | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | ADI | - | ADI | ADI | ADI | ADI | ADI |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown | unknown |
| Converter type | A/D CONVERTER | - | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
| JESD-30 code | R-PDIP-T28 | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
| Number of digits | 10 | - | 10 | 10 | 10 | 10 | 10 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | - | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | - | 85 °C | 125 °C | 125 °C | 85 °C | 70 °C |
| Minimum operating temperature | - | - | -25 °C | -55 °C | -55 °C | -25 °C | - |
| Output bit code | OFFSET BINARY | - | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| Package body material | PLASTIC/EPOXY | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | - | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | - | NO | NO | NO | NO | NO |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | OTHER | MILITARY | MILITARY | OTHER | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
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