CLD-DS71 Rev 2C
Product family data sheet
cree Xlamp Xh-G led
®
®
Product descriPtioN
Unlike common plastic packages,
XLamp XH LeDs use a ceramic
package
and
to
deliver
not
the
unique
available
LeDs.
combination of high performance
reliability
in
elsewhere
mid-power
features
• Package size: 3.0 X 3.0 mm
• Available in white, 70-minimum
CRI cool white, 80-minimum
CRI white and 85- and
90-minimum CRI warm white
• 350 mA maximum drive current
• viewing angle: 130°
• Reflow solderable ‑ JEDEC
J‑STD‑020C compatible
• Unlimited floor life at
≤ 30 °C/85% RH
• RoHS- and ReACh-compliant
• UL-recognized component
table of coNteNts
Characteristics ......................... 2
Flux Characteristics................... 3
Relative Spectral Power
Distribution.............................. 4
Relative Flux vs. Junction
Temperature ............................ 4
electrical Characteristics ............ 5
Relative Flux vs. Current ........... 5
Typical Spatial Distribution ......... 6
Thermal Design ........................ 6
Reflow Soldering Characteristics . 7
Notes ...................................... 8
Mechanical Dimensions.............. 9
Tape and Reel ........................ 10
Packaging .............................. 11
The ceramic-based XH LeDs are
designed to deliver the long L70
lifetimes of Cree’s other high-power
LeDs, such as XP or XT LeDs, as well
as industry‑leading LED efficacy
levels.
Optimized
for
fluorescent
(e349212)
replacement lighting applications,
such as troffers and panel lights,
where high efficacy, long lifetime
and
smooth
appearance
to
offer
are
critical, the XH LeDs allow lighting
manufacturers
products
that meet the lifetime expectations
of LeD technology.
www.CREE.COm/XLamp
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo
and XLamp
®
are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
xlamp xH-G led
characteristics
characteristics
Thermal resistance, junction to solder point
viewing angle (FWHM)
Temperature coefficient of voltage
eSD withstand voltage (HBM per Mil-Std-883D)
DC forward current
Reverse voltage
Forward voltage (@ 65 mA, 25 °C)
LeD junction temperature
unit
°C/w
degrees
mV/°C
v
mA
v
v
°C
2.9
minimum
typical
20
130
-1.2
8000
350
-5
3.4
150
maximum
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
2
xlamp xH-G led
fluX characteristics (t
J
= 25 °c)
The following table provides several base order codes for XLamp XH-G LeDs. It is important to note that the base order
codes listed here are a subset of the total available order codes for the product family. For more order codes, as well
as a complete description of the order-code nomenclature, please consult the XLamp XH Family Binning and Labeling
document.
calculated
minimum
luminous flux
(lm)*
300 ma
113
113
113
113
113
113
113
113
113
76
76
XHGAWT-00-0000-00000LX51
XHGAWT-00-0000-00000LXe5
XHGAWT-00-0000-00000LXe7
XHGAWT-00-0000-00000BX51
XHGAWT-00-0000-00000BXe5
XHGAWT-00-0000-00000BXe7
XHGAWT-00-0000-00000HX51
XHGAWT-00-0000-00000HXe5
XHGAWT-00-0000-00000HXe7
XHGAWT-00-0000-00000Pve7
XHGAWT-00-0000-00000Uve7
color
cct range
base order codes
minimum luminous
flux @ 65 ma
Group
J3
J3
J3
J3
J3
J3
J3
J3
J3
H0
H0
flux (lm)
26.8
26.8
26.8
26.8
26.8
26.8
26.8
26.8
26.8
18.1
18.1
order code
min.
Cool White
Neutral White
Warm White
5000 K
3700 K
2600 K
5000 K
70-CRI White
3700 K
2600 K
5000 K
80-CRI White
3700 K
2600 K
85-CRI White
90-CRI White
2600 K
2600 K
max.
8300 K
5000 K
3700 K
8300 K
5000 K
3700 K
8300 K
5000 K
3700 K
3200 K
3200 K
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy)
measurements and ±2 on CRI measurements.
• Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75.
• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
• Minimum CRI for 70-CRI Minimum Cool White is 70.
• Minimum CRI for 80-CRI Minimum White is 80.
• Minimum CRI for 85-CRI Minimum White is 85.
• Minimum CRI for 90-CRI Minimum White is 90.
* Calculated flux values at 300 ma are for reference only.
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
3
xlamp xH-G led
relative sPectral Power distributioN
Relative Spectral Power
100
Relative Radiant Power (%)
80
60
Cool White
Warm White
40
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
relative fluX vs. JuNctioN temPerature (i
f
= 65 ma)
100
Relative Luminous Flux (%)
80
60
40
20
0
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
4
xlamp xH-G led
Electrical Characteristics (Tj = 85ºC)
electrical characteristics (t
J
= 25 °c)
350
325
300
Forward Current (mA)
275
250
225
200
175
150
125
100
75
50
25
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)
relative fluX vs. curreNt (t
J
= 25 °c)
450
Relative Luminous Flux (%)
400
350
300
250
200
150
100
50
0
25
50
75
100
125
150
175
200
225
250
275
300
325
350
Forward Current (mA)
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
5
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