HSMW-B191, HSMW-B265, HSMW-B197, HSMW-B120
Bluish White ChipLEDs
Data Sheet
Description
These pastel ChipLEDs come in unique shades of white
and provide product differentiation for back-lighting ap-
plications. They are designed in industry standard pack-
ages for ease of handling and use.
These chipLEDs come in either top emitting packages
(HSMW-B191, 265 & 197) or in a side emitting package
(HSMW-B120).
The packages are compatible with IR reflow soldering
processes and comes in 8 mm tape on 7" diameter reels.
They are compatible with automatic placement equip-
ment.
In order to facilitate pick and place operation, these chip-
LEDs are shipped in tape and reel with 4000 units per reel
for HSMW-B191, 197, and 120 packages, and 3000 units
per reel for HSMW-B265 packages.
Features
x
Unique pastel white colors
x
Small size
x
Industry standard footprint
x
Compatible with IR soldering
x
Compatible with automatic placement equipment
x
Operating temperature range -40˚C to +85˚C
x
Come in 8 mm tape on 7" diameter reels
Applications
x
LCD backlighting
x
Keypad backlighting
x
Pushbutton backlighting
x
Symbol backlighting
CAUTION:
HSMW-Bxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
CATHODE
MARK
LED DIE
CATHODE
MARK
0.8 (0.031)
1.25 (0.049)
1.6
(0.063 )
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
0.4 (0.016)
3.4 (0.134 )
POLARITY
DIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
1.2
(0.047)
POLARITY
1.1 (0.043)
0.6 (0.023)
0.3 (0.012)
0.30 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMW-B191
HSMW-B265
LED DIE
LED DIE
0.3 (0.012)
0.6 (0.024)
0.8 (0.031)
1.6
(0.063 )
0.4 (0.016)
1.6 (0.063)
POLARITY
POLARITY
DIFFUSED
EPOXY
PC BOARD
0.4 (0.016)
0.16 (0.006)
DIFFUSED
EPOXY
PC BOARD
1.2 (0.047)
1.0 (0.039)
0.5 (0.020)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
CATHODE LINE
3 – 0.3 (0.012)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMW-B197
HSMW-B120
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED.
2
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 0.8 (W) x 0.6 (H)
3.4 (L) x 1.25 (W) x 1.1 (H)
[2]
1.6 (L) x 0.8 (W) x 0.4 (H)
1.6 (L) x 0.6 (W) x 1.0 (H)
[1]
Notes:
1. Right angle package.
2. Reverse mount package.
Bluish White
HSMW-B191
HSMW-B265
HSMW-B197
HSMW-B120
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Absolute Maximum Ratings at T
A
= 25˚C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
= 100 μA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
HSMW-Bxxx
20
78
5
95
–40 to +85
–40 to +85
Units
mA
mW
V
˚C
˚C
˚C
See reflow soldering profile (Figures 9 & 10)
Electrical Characteristics at T
A
= 25˚C
Forward
Voltage
V
F
(Volts)
@ I
F
= 20 mA
[1]
Typ.
Max.
3.6
3.9
Part Number
HSMW-Bxxx
Note:
1. V
F
tolerance: ± 0.1 V
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100 μA
Min.
5
Capacitance C
(pF), V
F
= 0,
f = 1 MHz
Typ.
55
Thermal
Resistance
RT
J-PIN
(˚C/W)
Typ.
450
Optical Characteristics at T
A
= 25˚C
Luminous Intensity
I
v
(mcd)
@ 20 mA
[1, 4]
Min.
Typ.
28.5
28.5
28.5
28.5
110.0
110.0
110.0
110.0
Part Number
HSMW-B191
HSMW-B265
HSMW-B120
HSMW-B197
Chromaticity
Coordinates
[2]
Typ.
x
y
0.20
0.20
0.20
0.20
0.19
0.19
0.19
0.19
Viewing Angle
2T
1/2
Degrees
[3]
Typ.
140
150
155
130
Luminous
Efficacy
K
v
(lm/w)
Typ.
170
170
170
170
Notes:
1. The luminous intensity, I
v
, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength,
O
d
, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3.
T
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. Luminous intensity (I
v
) tolerance: ± 15%.
3
Light Intensity (Iv) Bin Limits
[1]
Intensity (mcd)
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Tolerance: ± 15%
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
4
SMT BLUISH WHITE COLOR BIN STRUCTURES
0.30
0.28
0.26
Y-COORDINATE
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.16
C
B
A
100
– mA
1.2
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
I
F
– FORWARD CURRENT
10
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
1
0.18
0.20
0.22
0.24
0.1
2.0
2.5
3.0
3.5
4.0
X-COORDINATE
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
Figure 1. Color bin limits (CIE 1931 Chromaticity
Diagram) [Tolerance: ± 0.02].
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
25
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward cur-
rent.
100
90
–%
RELATIVE INTENSITY
0 10 20 30 40 50 60 70 80 90 100
T
A
– AMBIENT TEMPERATURE – °C
20
15
10
5
0
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 4. Maximum forward current vs. ambient
temperature.
100
90
RELATIVE INTENSITY – %
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
Figure 5. Relative intensity vs. angle for HSMW-B191.
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMW-B265.
5
Embedded System
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