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KS57P2316

Description
BONDING DIAGRAM
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size39KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

KS57P2316 Overview

BONDING DIAGRAM

KS57P2316 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeQFP
package instructionQFP,
Contacts80
Reach Compliance Codeunknow
Has ADCNO
Address bus width
bit size4
maximum clock frequency6 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PQFP-G80
length20 mm
Number of I/O lines40
Number of terminals80
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
ROM programmabilityOTPROM
Maximum seat height3 mm
speed1.0475 MHz
Maximum supply voltage5.5 V
Minimum supply voltage2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width14 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
BONDING DIAGRAM
PRODUCT
KS57P2316
PAGE
REV NO.
1
80
75
70
65
61
5
60
10
55
Y = 4460um
ID : -1552 -1997
X = 3620um
15
50
CJ7235X
20
21
25
30
35
40
41
45
TITLE
L/F MAT’L
CHIP SIZE
BACK METAL
ALLOY42
3620x4460um
BARE_Si
CJ7235X
#1
PKG TYPE
DEV NAME
LF PAD SIZE
80_QFP_1420C
CJ7235X_Rev0_1420C
283x283 MIL
S A M S U N G
DOC. # : RK8011-05-03(1/2)

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