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DMN5L06

Description
SINGLE N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
File Size175KB,4 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
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DMN5L06 Overview

SINGLE N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR

DMN5L06
SINGLE N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
Single N-Channel MOSFET
Low On-Resistance
Very Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 2)
“Green” Device (Note 3)
Mechanical Data
SOT-23
NEW PRODUCT
Case: SOT-23
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Finish
Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.008 grams (approximate)
Drain
D
Gate
TOP VIEW
G
Source
S
Equivalent Circuit
TOP VIEW
Pin Out Configuration
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
DSS
V
DGR
Continuous
Pulsed
Continuous
Pulsed
V
GSS
I
D
I
DM
Value
50
50
±20
±40
280
1.5
Units
V
V
V
mA
A
Characteristic
Drain-Source Voltage
Drain-Gate Voltage R
GS
1.0MΩ
Gate-Source Voltage
Drain Current (Note 1)
Drain Current (Note 1)
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Symbol
P
d
R
θ
JA
T
j,
T
STG
Value
350
357
-55 to +150
Units
mW
°C/W
°C
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
On-State Drain Current
Forward Transconductance
Source-Drain Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes:
@T
A
= 25°C unless otherwise specified
Symbol
BV
DSS
@ T
C
= 25°C
@ T
C
= 125°C
I
DSS
I
GSS
V
GS(th)
R
DS (ON)
I
D(ON)
g
FS
V
SD
C
iss
C
oss
C
rss
Min
50
0.49
0.5
200
0.5
Typ
1.6
2.2
1.0
Max
0.1
500
±20
1.2
3
4
1.4
50
25
5.0
Unit
V
µA
nA
V
Ω
A
mS
V
pF
pF
pF
Test Condition
V
GS
= 0V, I
D
= 10μA
V
DS
= 50V, V
GS
= 0V
V
GS
= ±20V, V
DS
= 0V
V
DS
= V
GS
, I
D
= 250μA
V
GS
= 2.7V, I
D
= 0.2A,
V
GS
= 1.8V, I
D
= 50mA
V
GS
= 10V, V
DS
= 7.5V
V
DS
=10V, I
D
= 0.2A
V
GS
= 0V, I
S
= 115mA
V
DS
= 25V, V
GS
= 0V
f = 1.0MHz
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
4. Short duration pulse test used to minimize self-heating effect.
DMN5L06
Document number: DS30614 Rev. 4 - 2
1 of 4
www.diodes.com
October 2007
© Diodes Incorporated

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