CMOS 1K X 9 FIFO
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SHARP |
| package instruction | 0.450 INCH, PLASTIC, LCC-32 |
| Reach Compliance Code | unknow |
| Maximum access time | 15 ns |
| Other features | RETRANSMIT |
| period time | 25 ns |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 9216 bi |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 3.56 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
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