The documentation and process conversion measures
necessary to comply with this document shall be
completed by 9 April 2004.
INCH-POUND
MIL-PRF-19500/391J
9 December 2004
SUPERSEDING
MIL-PRF-19500/391H
30 April 2003
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER
TYPES 2N3019, 2N3019S, 2N3057A, 2N3700, AND 2N3700UB
JAN, JANTX, JANTXV, JANS, JANHCA AND JANKCA
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for NPN, silicon, low-power transistors. Four
levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product
assurance are provided for the unencapsulated device type 2N3700.
1.2 Physical dimensions. See figure 1, 2N3019 (TO-5) and 2N3019S (similar to TO-39), figure 2, 2N3057A
(TO-46), figure 3, 2N3700 (TO-18), figure 4, 2N3700UB, and figure 5, JANHCA2N3700 and JANKCA2N3700.
1.3 Maximum ratings unless otherwise specified T
A
= +25°C.
I
C
A dc
1
Types
V
CBO
V dc
140
P
T
T
A
= +25°C
(1) (2)
W
0.800
0.800
0.500
0.500
0.500
V
EBO
V dc
7
P
T
T
C
= +25°C
(1) (2)
W
5
5
1.8
1
N/A
V
CEO
V dc
80
T
J
and T
STG
°C
-65 to +200
R
θJA
(2) (3) (4)
°C/W
175
175
325
325
325
R
θJC
(2) (3)
°C/W
30
30
80
150
N/A
R
θJSP(IS)
(2) (3)
°C/W
N/A
N/A
N/A
N/A
90
2N3019
2N3019S
2N3057A
2N3700
2N3700UB
(1)
(2)
(3)
(4)
P
T
T
SP(IS)
= +25°C
(1) (2)
W
N/A
N/A
N/A
N/A
1.5
For derating, see figures 6, 7, 8, 9, 10, 11, and 12.
See 3.3.
For thermal curves, see figures 13, 14, 15, 16, 17, 18, and 19.
For non-thermal conductive PCB or unknown PCB surface mount conditions in free air, substitute figures 7 and
12 for the UB package and use R
θJA
.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil.
Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at
http://assist.daps.dla.mil
.
AMSC N/A
FSC 5961
MIL-PRF-19500/391J
1.4 Primary electrical characteristics.
Limits
h
FE1
V
CE
= 10 V dc
I
C
= 150 mA dc
h
FE2
V
CE
= 10 V dc
I
C
= 0.1 mA dc
h
FE3
(1)
V
CE
= 10 V dc
I
C
= 10 mA dc
h
FE4
(1)
V
CE
= 10 V dc
I
C
= 500 mA dc
Min
Max
100
300
50
200
90
50
200
Types
Limit
h
FE5
(1)
V
CE
= 10 V dc
I
C
= 1 A dc
V dc
|h
fe
|
f = 20 MHz
V
CE
= 10 V dc
I
C
= 50 mA dc
C
obo
100 kHz
≤
f
≤
1 MHz
V
CB
= 10 V dc
I
E
= 0
pF
2N3019, 2N3019S
2N3057A, 2N3700
2N3700UB
Min
Max
15
5
20
12
Types
Limits
V
CE(sat)1
(1)
I
C
= 150 mA dc
I
B
= 15 mA dc
V dc
V
CE(sat)2
(1)
I
C
= 500 mA dc
I
B
= 50 mA dc
V dc
V
BE(sat)
(1)
I
C
= 150 mA dc
I
B
= 15 mA dc
V dc
2N3019, 2N3019S
2N3057A, 2N3700
2N3700UB
Min
Max
(1) Pulsed, see 4.5.1.
0.2
0.5
1.1
2
MIL-PRF-19500/391J
Symbol
Dimensions
Inches
Millimeters
Notes
Min
Max
0.305
0.335
0.240
0.260
0.335
0.370
0.200 TP
0.016
0.021
0.500
0.750
0.016
0.019
---
0.050
0.250
---
---
0.050
0.029
0.045
0.028
0.034
---
0.010
45° TP
0.100
Min
Max
7.75
8.51
6.10
6.60
8.51
9.40
5.08 TP
0.41
0.53
12.70 19.05
.041
0.48
---
1.27
6.35
---
---
1.27
0.74
1.14
0.71
0.86
---
0.25
45° TP
2.54
CD
CH
HD
LC
LD
LL
LU
L
1
L
2
Q
TL
TW
r
α
P
TO-39
TO-5
6
7, 8
7, 8, 12
7, 8
7, 8
7, 8
5
4
3
10
6
NOTES:
1. Dimension are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within
.007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC.
The device may be measured by direct methods.
7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and minimum. Diameter is
uncontrolled in L1 and beyond LL minimum.
8. All three leads.
9. The collector shall be internally connected to the case.
10. Dimension r (radius) applies to both inside corners of tab.
11. In accordance with ASME Y14.5M, diameters are equivalent to Nx symbology.
12. For "S" suffix devices, dimension LL is 0.500 (12.70 mm) minimum, 0.750 (19.05 mm) maximum.
13. "S" suffix devices, dimension LL is 0.50 (12.70 mm) minimum, 0.75 (19.05 mm) maximum.
14. "L" suffix devices, dimension LL is 1.500 (38.10 mm) minimum, 1.750 (44.45 mm) maximum. 13.
15. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 1. Physical dimensions for device types 2N3019 (TO-5) and 2N3019S (TO-39).
3
MIL-PRF-19500/391J
Symbol
CD
CH
HD
LC
LD
LL
LU
L1
L2
TL
TW
r
α
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.178
.195
4.52
4.95
.065
.085
1.65
2.16
.209
.230
5.31
5.84
.100 TP
2.54 TP
.016
.021
0.41
0.53
.500
1.750
12.70
44.45
.016
.019
0.41
0.48
.050
1.27
.250
6.35
.028
.048
0.71
1.22
.036
.046
0.91
1.17
.007
0.18
45° TP
45° TP
Note
6
7
7
7
7
7
3
2
10, 11
6
NOTES:
1. Dimension are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 inch (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within
.007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at
MMC. The device may be measured by direct methods.
6. Dimension LU applies between L
1
and L
2
. Dimension LD applies between L
2
and LL minimum. Diameter
is uncontrolled in L
1
and beyond LL minimum.
7. All three leads.
8. The collector shall be internally connected to the case.
7. Dimension r (radius) applies to both inside corners of tab.
10. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
11. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 2. Physical dimensions for 2N3057A (TO-46).
4
MIL-PRF-19500/391J
Symbol
CD
CH
HD
LC
LD
LL
LU
L1
L2
P
Q
TL
TW
r
α
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.178
.195
4.52
4.95
.170
.210
4.32
5.33
.209
.230
5.31
5.84
.100 TP
2.54 TP
.016
.021
0.41
0.53
.500
.750
12.70
19.05
.016
.019
0.41
0.48
.050
1.27
.250
6.35
.100
2.54
.030
0.76
.028
.048
0.71
1.22
.036
.046
0.91
1.17
.010
0.25
45° TP
45° TP
1, 2, 9, 11, 12
Note
TO-18
6
7,8
7,8
7,8
7,8
7,8
5
3,4
3
10
6
NOTES:
1. Dimension are in inches.
2. Millimeters are given for general
information only.
3. Beyond r (radius) maximum, TH shall be
held for a minimum length of .011 (0.28
mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD,
and Q.
6. Leads at gauge plane .054 +.001 -.000 inch (1.37
+0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum
material condition (MMC) relative to tab at MMC. The device may be measured by direct methods or by the
gauge and gauging procedure shown in figure 2.
7. Dimension LU applies between L
1
and L
2
. Dimension LD applies between L
2
and LL minimum. Diameter is
uncontrolled in L
1
and beyond LL minimum.
8. All three leads.
9. The collector shall be internally connected to the case.
10. Dimension r (radius) applies to both inside corners of tab.
11. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 3. Physical dimensions for type 2N3700 (TO-18).
5
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