HANBit
HSD32M64F8R
Synchronous DRAM Module 256Mbyte (32Mx64bit), SMM ,16Mx16,
4Banks, 8K Ref. 3.3V
Part No. HSD32M64F8R
GENERAL DESCRIPTION
The HSD32M64F8R is a 32M x 64 bit Synchronous Dynamic RAM high-density memory module. The module consists
of
eight
CMOS 16M x 8 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages and 2K EEPROM in 8-pin
TSSOP package on a 120-pin glass-epoxy. Three 0.1uF decoupling capacitors are mounted on the printed circuit board in
parallel for each SDRAM. The HSD32M64F8R is a SMM(Stackable Memory Module type) .Synchronous design allows
precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating
frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high
performance memory system applications All module components may be powered from a single 3.3V DC power supply
and all inputs and outputs are LVTTL-compatible.
FEATURES
•
Part Identification
HSD32M64F8R-10L : 100MHz (CL=3)
HSD32M64F8R-10 : 100MHz (CL=2)
HSD32M64F8R-13 : 133MHz (CL=3)
•
Burst mode operation
•
Auto & self refresh capability (8K Cycles/64ms)
•
LVTTL compatible inputs and outputs
•
Single 3.3V
±0.3V
power supply
•
MRS cycle with address key programs
- Latency (Access from column address)
- Burst length (1, 2, 4, 8 & Full page)
- Data scramble (Sequential & Interleave)
•
All inputs are sampled at the positive going edge of the system clock
•
The used device is 4M x 16bit x 4Banks SDRAM
URL:www.hbe.co.kr
REV.1.0(August.2002).
-1-
HANBit Electronics Co.,Ltd
HANBit
PIN ASSIGNMENT
BOTTOM
P1
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Symbo
l
Vcc
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
Vcc
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
Vcc
DQM4
DQM5
REGE
CKE0
NC
Vcc
SDA
SCL
/CS1
/CS3
Vcc
PIN
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbo
l
Vss
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
Vss
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Vss
DQM0
DQM1
/WE
CLK0
CLK1
Vss
/CAS
/RAS
/CS0
/CS2
Vss
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P2
Symbo
l
Vss
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
Vss
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
Vss
DQM2
DQM3
NC
BA0
BA1
A10
A0
A1
A2
A3
Vss
PIN
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbol
Vcc
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
Vcc
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
Vcc
DQM6
DQM7
A12
A11
A9
A8
A7
A6
A5
A4
Vcc
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Symb
ol
Vcc
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
Vcc
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
Vcc
DQM4
DQM5
REGE
CKE0
NC
Vcc
SDA
SCL
/CS3
NC
Vcc
P3
PIN
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symb
ol
Vss
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
Vss
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Vss
DQM0
DQM1
/WE
CLK0
CLK1
Vss
/CAS
/RAS
/CS2
NC
Vss
HSD32M64F8R
TOP
P4
PI
N
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Symb
ol
Vss
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
Vss
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
Vss
DQM2
DQM3
NC
BA0
BA1
A10
A0
A1
A2
A3
Vss
PIN
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbo
l
Vcc
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
Vcc
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
Vcc
DQM6
DQM7
A12
A11
A9
A8
A7
A6
A5
A4
Vcc
* Pin Names
A0~A12: Address input (Multiplexed)
DQ0~DQ63: Data input/output
CKE0: Clock enable input
/RAS: Row address strobe
/CAS: Coulmn address strobe
DQM0~7: DQM
REGE: Register enable
SDA: Serial data I/O
NC: No connection
BA0~BA1: Select bank
CLK0: Clock input
/CS0, /CS2: Chip select input
/WE: Write enable
V
SS
: Ground
Vcc: Power supply(3.3V)
SCL: Serial clock
DU: Don’t use
URL:www.hbe.co.kr
REV.1.0(August.2002).
-2-
HANBit Electronics Co.,Ltd
HANBit
Functional Block Diagram
HSD32M64F8R
URL:www.hbe.co.kr
REV.1.0(August.2002).
-3-
HANBit Electronics Co.,Ltd
HANBit
PIN FUNCTION DESCRIPTION
Pin
CLK
/CE
Name
System clock
Chip enable
Input Function
Active on the positive going edge to sample all inputs.
HSD32M64F8R
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE
Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
CKE should be enabled 1CLK+tss prior to valid command.
A0 ~ A12
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA12, Column address : CA0 ~ CA8
BA0 ~ BA1
Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
/RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with /RAS low.
Enables row access & precharge.
/CAS
Column
strobe
address
Latches column addresses on the positive going edge of the CLK with /CAS low.
Enables column access.
/WE
Write
enable
Enables write operation and row precharge.
Latches data in starting from /CAS, /WE active.
DQM0 ~ 7
Data
mask
input/output
Makes data output Hi-Z, tsHZ after the clock and masks the output.
Blocks data input when DQM active. (Byte masking)
The device operates in the transparent mode when REGE is low. When REGE is
high, the
device operates in the registered mode. In registered mode, the Address and
control inputs are latched if CLK is held at a high or low logic level. The inputs are
strobed in the latch/flip-flop on the riging edge of CLK. REGE is tied to V
DD
through 10K ohm register on PCB. So if REGE of module is floating, this module
will be operated as registerd mode.
REGE
Register enable
DQ0 ~ 63
Vcc/Vss
Data input/output
Power
supply/ground
Data inputs/outputs are multiplexed on the same pins.
Power and ground for the input buffers and the core logic.
URL:www.hbe.co.kr
REV.1.0(August.2002).
-4-
HANBit Electronics Co.,Ltd
HANBit
ABSOLUTE MAXIMUM RATINGS
HSD32M64F8R
PARAMETER
Voltage on Any Pin Relative to Vss
Voltage on Vcc Supply Relative to Vss
Power Dissipation
Storage Temperature
SYMBOL
V
IN ,OUT
Vcc
P
D
T
STG
RATING
-1V to 4.6V
-1V to 4.6V
8W
-55oC to 150oC
Short Circuit Output Current
I
OS
50mA
Notes:
Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
DC OPERATING CONDITIONS
(Recommended operating conditions (Voltage referenced to Vss = 0V, T
A
= 0 to 70°C) )
PARAMETER
Supply Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
SYMBOL
Vcc
V
IH
V
IL
V
OH
V
OL
MIN
3.0
2.0
-0.3
2.4
-
TYP.
3.3
3.0
0
-
-
MAX
3.6
Vcc+0.3
0.8
-
0.4
UNIT
V
V
V
V
V
1
2
I
OH
= -2mA
I
OL
= 2mA
3
NOTE
Input leakage current
I
LI
-10
-
10
uA
Notes :
1. V
IH
(max) = 5.6V AC. The overshoot voltage duration is
≤
3ns.
2. V
IL
(min) = -2.0V AC. The undershoot voltage duration is
≤
3ns.
3. Any input 0V
≤
V
IN
≤
V
DDQ
.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
(Vcc = 3.3V, T
A
= 23°C, f = 1MHz, V
REF
=1.4V
±
200 mV)
DESCRIPTION
Input capacitance(A0~A11)
Input capacitance(/RAS, /CAS,/WE)
Input capacitance(CKE0)
Input capacitance(CLK0)
Input capacitance(/CE0,CE3)
Input capacitance(DQM0~DQM7)
Input capacitance(BA0~BA1)
Data input/output capacitance (DQ0 ~ DQ63)
SYMBOL
C
IN1
C
IN2
C
IN3
C
IN4
C
IN5
C
IN3
C
IN3
C
OUT
MIN
2.5
2.5
2.5
2.5
2.5
2.5
2.5
4.0
MAX
5.0
5.0
5.0
4.0
5.0
5.0
5.0
6.5
UNITS
pF
pF
pF
pF
pF
pF
pF
pF
URL:www.hbe.co.kr
REV.1.0(August.2002).
-5-
HANBit Electronics Co.,Ltd
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