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GS88418B-166

Description
512K x 18, 256K x 36 8Mb S/DCD Sync Burst SRAMs
Categorystorage    storage   
File Size543KB,25 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Download Datasheet Parametric View All

GS88418B-166 Overview

512K x 18, 256K x 36 8Mb S/DCD Sync Burst SRAMs

GS88418B-166 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerGSI Technology
Parts packaging codeBGA
package instructionBGA, BGA119,7X17,50
Contacts119
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Maximum access time8.5 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density9437184 bi
Memory IC TypeCACHE SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height2.4 mm
Maximum standby current0.04 A
Minimum standby current3.14 V
Maximum slew rate0.38 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Preliminary
GS88418/36B-200/180/166/150/133
119-Bump BGA
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipelined
operation
• Single/Dual Cycle Deselect Selectable
• ZQ mode pin for user-selectable high/low output drive strength
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Common data inputs and data outputs
• Clock Control, registered, address, data, and control
• Internal self-timed write cycle
• Automatic power-down for portable applications
• 119-bump BGA package
512K x 18, 256K x 36
8Mb S/DCD Sync Burst SRAMs
Flow Through/Pipeline Reads
200 MHz–133 MHz
3.3 V V
DD
3.3 V and 2.5 V I/O
(LBO) input. The Burst function need not be used. New
addresses can be loaded on every cycle with no degradation of
chip performance.
The function of the Data Output register can be controlled by
the user via the FT mode bump (Bump 5R). Holding the FT
mode pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
SCD and DCD Pipelined Reads
The GS88436B is a SCD (Single Cycle Deselect) and DCD
(Dual Cycle Deselect) pipelined synchronous SRAM. DCD
SRAMs pipeline disable commands to the same degree as read
commands. SCD SRAMs pipeline deselect commands one
stage less than read commands. SCD RAMs begin turning off
their outputs immediately after the deselect command has been
captured in the input registers. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock. The user may
configure this SRAM for either mode of operation using the
SCD mode input on Bump 4L.
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
tCycle
t
KQ
I
DD
t
KQ
tCycle
I
DD
-200
5.0
3.0
450
7.5
10
270
-180
5. 5
3.2
410
8
10
270
-166
6.0
3.5
380
8.5
10
250
-150
6.7
3.8
350
9.0
10
240
-133
7.5
4.0
340
9.5
10
220
Unit
ns
ns
mA
ns
ns
mA
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Functional Description
Applications
The GS88418/36B is a 9,437,184-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ
low) for multi-drop bus applications and normal drive strength
(ZQ floating or high) point-to-point applications. See the
Output Driver Characteristics chart for details.
Controls
Addresses, data I/Os, chip enables (E1, in x18 version, E1 and
E2 in x36 version), address burst control inputs (ADSP,
ADSC, ADV), and write control inputs (Bx, BW, GW) are
synchronous and are controlled by a positive-edge-triggered
clock input (CK). Output enable (G) and power-down control
(ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order
Rev: 1.05 10/2001
1/25
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS884B operates on a 3.3 V power supply and all inputs/
outputs are 3.3 V- and 2.5 V-compatible. Separate output
power (V
DDQ
) pins are used to decouple output noise from the
internal circuit.
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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